ADP5062CP-EVALZ Analog Devices, ADP5062CP-EVALZ Datasheet - Page 8

• Manufacturer Part Number: ADP5062CP-EVALZ
• Description: Power Management IC Development Tools ADP5062 Evaluation board
• Manufacturer: Analog Devices
• Type: Linear Regulators - Standardr
• Series: ADP5062r

Specifications of ADP5062CP-EVALZ

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: ADP5062
• Input Voltage: 4 V to 6.7 V
• Description/function: Battery charger (isolated flyback)
• Interface Type: I2C
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Output Current: 2.1 A
• Factory Pack Quantity: 1
• For Use With: ADP5062

ADP5062
ABSOLUTE MAXIMUM RATINGS
Table 4. Absolute Maximum Ratings
Parameter
VIN1, VIN2, VIN3 to AGND
All Other Pins to AGND
Continuous Drain Current, Battery Supple-
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for a device soldered in a circuit board for surface-
mount packages.
Table 5. Thermal Resistance
Package Type
20-Lead LFCSP
JA
mentary Mode, from ISO_Bx to ISO_Sx
is specified for the worst-case conditions, that is, θ
θ
35.6
JA
θ
3.65
JC
Rating
–0.5 V to +20 V
–0.3 V to +6 V
2.1 A
–65°C to +150°C
–40°C to +125°C
JEDEC J-STD-020
JA
Unit
°C/W
is
Rev. 0 | Page 8 of 44
Maximum Power Dissipation
The maximum safe power dissipation in the
is limited by the associated rise in junction temperature (T
the die. At a die temperature of approximately 150°C (the glass
transition temperature), the properties of the plastic change.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, thereby perma-
nently shifting the parametric performance of the ADP5062.
Exceeding a junction temperature of 175°C for an extended
period can result in changes in the silicon devices, potentially
causing failure.
ESD CAUTION
ADP5062
Data Sheet
package
J
) on