PBSS2540MB,315 NXP Semiconductors, PBSS2540MB,315 Datasheet

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PBSS2540MB 40 V, 0.5 A NPN low VCEsat (BISS) transistor Rev. 1 — 4 April 2012 1. Product profile 1.1 General description NPN low V DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS3540MB. 1.2 Features and benefits  ...

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... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 B base 2 E emitter 3 C collector 3. Ordering information Table 3. Ordering information Type number Package Name PBSS2540MB DFN1006B-3 4. Marking Table 4. Marking codes Type number PBSS2540MB PIN 1 INDICATION READING EXAMPLE: 0111 1011 Fig 1. ...

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... NXP Semiconductors 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V collector-base voltage CBO V collector-emitter voltage CEO V emitter-base voltage EBO I collector current C I peak collector current CM I peak base current BM P total power dissipation ...

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... NXP Semiconductors 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter R thermal resistance th(j-a) from junction to ambient [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...

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... NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R collector-emitter CEsat saturation resistance V base-emitter saturation BEsat voltage V base-emitter turn-on BEon voltage f transition frequency T C collector capacitance c PBSS2540MB Product data sheet ...

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... NXP Semiconductors 1200 h FE 1000 (1) 800 600 (2) 400 (3) 200 0 − ( 150 °C amb ( °C amb ( -55 °C amb Fig 4. DC current gain as a function of collector current; typical values 1200 V BE (mV) 1000 (1) 800 (2) 600 400 (3) 200 −1 ...

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... NXP Semiconductors CEsat (mV − ( 150 °C amb ( °C amb ( -55 °C amb Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...

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... NXP Semiconductors 9. Package outline Fig 10. Package outline SOT883B (DFN1006B-3) 10. Soldering Footprint information for reflow soldering solder land solder paste deposit occupied area Fig 11. Reflow soldering footprint for SOT883B (DFN1006B-3) PBSS2540MB Product data sheet 0.65 0.55 0.35 0.20 0. 0.30 0.22 1.05 0.65 0.95 0.30 0.22 3 0.55 0.47 Dimensions in mm 1.3 0.7 0.9 0.25 (2x) 0.3 (2x) 0.4 (2x) solder land plus solder paste ...

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... NXP Semiconductors 11. Revision history Table 8. Revision history Document ID Release date PBSS2540MB v.1 20120404 PBSS2540MB Product data sheet 40 V, 0.5 A NPN low VCEsat (BISS) transistor Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1 — 4 April 2012 ...

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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...

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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . .7 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . .7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 11 Revision history ...