MD5811-D256-V3Q18-X SanDisk, MD5811-D256-V3Q18-X Datasheet - Page 62

• Manufacturer Part Number: MD5811-D256-V3Q18-X
• Description: IC MDOC P3 256MB 48-TSOP
• Manufacturer: SanDisk

Specifications of MD5811-D256-V3Q18-X

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 256M (32M x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

10.2 Standard NOR-Like Interface
Mobile DiskOnChip P3 uses a NOR-like interface that can easily be connected to any
microprocessor bus. With a standard interface, it requires 13 address lines, 8 data lines and basic
memory control signals (CE#, OE#, WE#), as shown in Figure 18 below. Typically, Mobile
DiskOnChip P3 can be mapped to any free 8KB memory space. In a PC-compatible platform, it is
usually mapped into the BIOS expansion area. If the allocated memory window is larger than 8KB,
an automatic anti-aliasing mechanism prevents the firmware from being loaded more than once
during the ROM expansion search.
Notes: 1. The 0.1 µF and the 10 nF low-inductance high-frequency capacitors must be attached to
59
(*) Address A0 is multiplexed with the DPD signal.
2. Mobile DiskOnChip P3 is an edge-sensitive device. CE#, OE# and WE# should be
each of the device’s VCC and VSS pins/balls. These capacitors must be placed as close
as possible to the package leads.
properly terminated (according to board layout, serial parallel or both terminations) to
avoid signal ringing.
Output Enable
Write Enable
Chip Enable
Address*
Chip ID
Reset
Data
0.1 uF
Figure 18: Standard System Interface
A[12:0]
OE#
D[15:0]
CE#
ID[1:0]
WE#
RSTIN
#
10 nF
Data Sheet, Rev. 0.3
3.3 V
VCC
DiskOnChip P3
0.1 uF
Mobile
VSS
DMARQ#
BUSY#
LOCK#
10 nF
VCCQ
DPD
1.8V or 3.3V
IRQ#
CLK
1-20 KOhm
Mobile DiskOnChip P3
93-SR-009-8L