MD5811-D256-V3Q18-X SanDisk, MD5811-D256-V3Q18-X Datasheet - Page 9

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MD5811-D256-V3Q18-X

Manufacturer Part Number
MD5811-D256-V3Q18-X
Description
IC MDOC P3 256MB 48-TSOP
Manufacturer
SanDisk
Datasheet

Specifications of MD5811-D256-V3Q18-X

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
256M (32M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MD5811-D256-V3Q18-X
Manufacturer:
M-SYSTEMS
Quantity:
19 491
Part Number:
MD5811-D256-V3Q18-X
Manufacturer:
M-SYSTEMS
Quantity:
20 000
2.
2.1
Mobile DiskOnChip P3, packed in the smallest available FBGA package with 256Mb (32MB)
capacity, is a single-die device with an embedded thin flash controller and flash memory. It uses
Toshiba’s cutting-edge, 0.13 micron NAND-based flash manufacturing process, enhanced by
M-Systems’ proprietary x2 technology.
M-Systems’ x2 technology provides performance enhancement with multi-plane operation, DMA
support, turbo operation and MultiBurst operation. The combination of NAND flash and
x2 technology results in a low-cost, minimal-sized flash disk that achieves unsurpassed reliability
levels and enhanced performance.
This breakthrough in performance, size and cost makes Mobile DiskOnChip P3 the ideal solution
for mobile product manufacturers who require high-capacity, small size, high-performance, and
above all, high-reliability storage to enable applications such as enhanced Multimedia Messaging
Service (MMS), gaming, video and Personal Information Management (PIM) on mobile handsets
and Personal Digital Assistants (PDAs).
Mobile DiskOnChip P3 content protection and security-enabling features offer several benefits.
Two write- and read-protected partitions, with both software- and hardware-based protection, can
be configured independently for maximum design flexibility. The 16-byte Unique ID (UID)
identifies each flash device, eliminating the need for a separate ID device on the motherboard. The
6KB One Time Programmable (OTP) area, written to once and then locked to prevent data and code
from being altered, is ideal for storing customer and product-specific information.
Mobile DiskOnChip P3 256Mb has a 2KB Programmable Boot Block. This block provides eXecute
In Place (XIP) functionality, enabling Mobile DiskOnChip P3 to replace the boot device and
function as the only non-volatile memory device on-board. Eliminating the need for an additional
boot device reduces hardware expenditures, board real estate, programming time, and logistics.
M-Systems’ patented TrueFFS software technology fully emulates a hard disk to manage the files
stored on Mobile DiskOnChip P3. This transparent file system management enables read/write
operations that are identical to a standard, sector-based hard disk. In addition, TrueFFS employs
patented methods, such as virtual mapping, dynamic and static wear-leveling, and automatic block
management to ensure high data reliability and to maximize flash life expectancy.
6
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Product Description
RODUCT
O
VERVIEW
Data Sheet, Rev. 0.3
Mobile DiskOnChip P3
93-SR-009-8L

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