ISL6609ACBZ-T Intersil, ISL6609ACBZ-T Datasheet - Page 6

• Manufacturer Part Number: ISL6609ACBZ-T
• Description: IC MOSFET DRVR SYNC BUCK 8-SOIC
• Manufacturer: Intersil

Specifications of ISL6609ACBZ-T

• Configuration: High and Low Side, Synchronous
• Input Type: PWM
• Delay Time: 18ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -

Electrical Specifications
NOTE:
Functional Pin Description
Note: Pin numbers refer to the SOIC package. Check
diagram for corresponding QFN pinout.
UGATE (Pin 1)
Upper gate drive output. Connect to gate of high-side
N-Channel power MOSFET. A gate resistor is never
recommended on this pin, as it interferes with the operation
shoot-through protection circuitry.
BOOT (Pin 2)
Floating bootstrap supply pin for the upper gate drive.
Connect a bootstrap capacitor between this pin and the
PHASE pin. The bootstrap capacitor provides the charge
used to turn on the upper MOSFET. See “Bootstrap
Considerations” on page 7 for guidance in choosing the
appropriate capacitor value.
PWM (Pin 3)
The PWM signal is the control input for the driver. The PWM
signal can enter three distinct states during operation, see
“Three-State PWM Input” on page 7 for further details. Connect
this pin to the PWM output of the controller.
GND (Pin 4)
Ground pin. All signals are referenced to this node.
UGATE Turn-On Propagation Delay
LGATE Turn-On Propagation Delay
Three-state to UG/LG Rising Propagation
Delay
OUTPUT
Upper Drive Source Resistance
Upper Drive Sink Resistance
Lower Drive Source Resistance
Lower Drive Sink Resistance
4. Limits established by characterization and are not production tested
PARAMETER
6
These specifications apply for T
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested. (Continued)
R
R
SYMBOL
R
R
UG_SRC
UG_SNK
t
LG_SRC
LG_SNK
t
PDHU
PDHL
t
PTS
ISL6609, ISL6609A
V
V
V
250mA Source Current
250mA Sink Current
250mA Source Current
250mA Sink Current
VCC
VCC
VCC
A
= 5V, Outputs Unloaded
= 5V, Outputs Unloaded
= 5V, Outputs Unloaded
= -40°C to 100°C, unless otherwise noted. Parameters with MIN and/or MAX
TEST CONDITIONS
LGATE (Pin 5)
Lower gate drive output. Connect to gate of the low side
N-Channel power MOSFET. A gate resistor is never
recommended on this pin, as it interferes with the operation
shoot-through protection circuitry.
VCC (Pin 6)
Connect this pin to a +5V bias supply. Locally bypass with a
high quality ceramic capacitor to ground.
EN (Pin 7)
Enable input pin. Connect this pin high to enable and low to
disable the driver.
PHASE (Pin 8)
Connect this pin to the source of the upper MOSFET. This
pin provides the return path for the upper gate driver current.
Thermal Pad (in QFN only)
The metal pad underneath the center of the IC is a thermal
substrate. The PCB “thermal land” design for this exposed
die pad should include vias that drop down and connect to
one or more buried copper plane(s). This combination of
vias for vertical heat escape and buried planes for heat
spreading allows the QFN to achieve its full thermal
potential. This pad should be either grounded or floating,
and it should not be connected to other nodes. Refer to
TB389 for design guidelines.
MIN
-
-
-
-
-
-
-
TYP
1.0
1.0
1.0
0.4
18
23
20
MAX
2.5
2.5
2.5
1.0
-
-
-
April 27, 2009
UNITS
FN9221.2
ns
ns
ns
Ω
Ω
Ω
Ω