LTC3890EGN-1#PBF Linear Technology, LTC3890EGN-1#PBF Datasheet - Page 36

• Manufacturer Part Number: LTC3890EGN-1#PBF
• Description: IC BUCK SYNC ADJ 25A DUAL 28SSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3890EGN-1#PBF

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 24 V
• Current - Output: 25A
• Frequency - Switching: 50kHz ~ 900kHz
• Voltage - Input: 4 ~ 60 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP
• Primary Input Voltage: 12V
• No. Of Outputs: 2
• Output Voltage: 24V
• Output Current: 25A
• No. Of Pins: 32
• Operating Temperature Range: -40°C To +125°C
• Msl: MSL 1 - Unlimited
• Supply Voltage Min: 4V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

LTC3890
PACKAGE DESCRIPTION
36
5.50 0.05
4.10 0.05
(4 SIDES)
3.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
3.45 0.05
5.00 0.10
(4 SIDES)
3.45 0.05
0.50 BSC
0.25 0.05
(Reference LTC DWG # 05-08-1693 Rev D)
32-Lead Plastic QFN (5mm × 5mm)
0.70 0.05
PACKAGE OUTLINE
UH Package
0.75 0.05
(4-SIDES)
3.50 REF
0.00 – 0.05
0.200 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 0.10
TYP
3.45 0.10
31
0.50 BSC
0.25 0.05
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 45 CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 0.10
3890fa