ADC08D1500DEV/NOPB National Semiconductor, ADC08D1500DEV/NOPB Datasheet - Page 37

• Manufacturer Part Number: ADC08D1500DEV/NOPB
• Description: BOARD DEV FOR ADC08D1500
• Manufacturer: National Semiconductor
• Series: PowerWise®r

Specifications of ADC08D1500DEV/NOPB

• Mfg Application Notes: Clocking High-Speed A/D Converters AppNote
• Number Of Adc's: 2
• Number Of Bits: 8
• Sampling Rate (per Second): 1.5G
• Data Interface: Serial
• Inputs Per Adc: 1 Differential
• Input Range: 870 mVpp
• Power (typ) @ Conditions: 1.8W @ 1.5GSPS
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: ADC08D1500
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADC08D1500DEV

the ADC08D1500 as many high speed amplifiers will have
higher distortion than will the ADC08D1500, resulting in over-
all system performance degradation.
Driving the V
mentioned in 2.1 THE REFERENCE VOLTAGE, the refer-
ence voltage is intended to be fixed by FSR pin or Full-Scale
Voltage Adjust register settings. Over driving this pin will not
change the full scale value, but can otherwise upset opera-
tion.
Driving the clock input with an excessively high level
signal. The ADC input clock level should not exceed the level
described in the Operating Ratings Table or the input offset
could change.
Inadequate input clock levels. As described in 2.3 THE
CLOCK INPUTS, insufficient input clock levels can result in
BG
pin to change the reference voltage. As
37
poor performance. Excessive input clock levels could result
in the introduction of an input offset.
Using a clock source with excessive jitter, using an ex-
cessively long input clock signal trace, or having other
signals coupled to the input clock signal trace. This will
cause the sampling interval to vary, causing excessive output
noise and a reduction in SNR performance.
Failure to provide adequate heat removal. As described in
2.6.2 Thermal Management, it is important to provide ade-
quate heat removal to ensure device reliability. This can be
done either with adequate air flow or the use of a simple heat
sink built into the board. The backside pad should be ground-
ed for best performance.
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