IRF6626 International Rectifier, IRF6626 Datasheet

MOSFET N-CH 30V 16A DIRECTFET

IRF6626

Manufacturer Part Number
IRF6626
Description
MOSFET N-CH 30V 16A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6626

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
5.4 mOhm @ 16A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
16A
Vgs(th) (max) @ Id
2.35V @ 250µA
Gate Charge (qg) @ Vgs
29nC @ 4.5V
Input Capacitance (ciss) @ Vds
2380pF @ 15V
Power - Max
2.2W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric ST
Configuration
Single Quad Drain Dual Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
5.4 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
16 A
Power Dissipation
2.2 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Fall Time
4.5 ns
Minimum Operating Temperature
- 40 C
Rise Time
15 ns
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
IRF6626TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF6626PBF
Manufacturer:
IR
Quantity:
1 000
Part Number:
IRF6626TRPBF
Manufacturer:
International Rectifier
Quantity:
135
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Description
The IRF6626 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6626 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching
losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors
operating at higher frequencies. The IRF6626 has been optimized for parameters that are critical in synchronous buck operating from 12 volt
buss converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

ƒ
Notes:
www.irf.com
Absolute Maximum Ratings
V
V
I
I
I
I
E
I
D
D
D
DM
AR
applications 
RoHS compliant containing no lead or bromide 
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible 
Ultra Low Package Inductance
Optimized for High Frequency Switching 
Ideal for CPU Core DC-DC Converters
Optimized for both Sync. FET and some Control FET
Low Conduction and Switching Losses
Compatible with existing Surface Mount Techniques 
DS
GS
AS
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET MOSFETs
Repetitive rating; pulse width limited by max. junction temperature.
@ T
@ T
@ T
SQ
15
10
A
A
C
5
0
= 25°C
= 70°C
= 25°C
3
Fig 1. Typical On-Resistance vs. Gate Voltage
SX
V GS, Gate -to -Source Voltage (V)
4
T J = 25°C
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
ST
5
T J = 125°C
6
Ãe
e
Parameter
I D = 16A
7
GS
GS
GS
MQ
@ 10V
@ 10V
@ 10V
f
8
k
MX
30V max ±20V max 4.0mΩ@ 10V 5.2mΩ@ 4.5V
Q
19nC
Starting T
Surface mounted on 1 in. square Cu board, steady state.
T
V
g tot
C
DSS
measured with thermocouple mounted to top (Drain) of part.
6.0
5.0
4.0
3.0
2.0
1.0
0.0
MT

0
J
Fig 2. Typical On-Resistance vs. Gate Voltage
6.7nC
= 25°C, L = 0.29mH, R
I D = 13A
Q
gd
V
DirectFET™ Power MOSFET ‚
GS
ST
Q G Total Gate Charge (nC)
1.6nC
Q
V DS = 24V
V DS = 15V
gs2
10
Max.
130
±20
30
16
13
72
24
13
R
DS(on)
5.4nC
G
Q
= 25Ω, I
TM
rr
IRF6626
packaging to achieve the
DirectFET™ ISOMETRIC
20
AS
13nC
Q
= 13A.
oss
R
DS(on)
Units
V
mJ
1.8V
11/17/05
V
A
A
gs(th)
30
1

Related parts for IRF6626

IRF6626 Summary of contents

Page 1

... The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6626 has been optimized for parameters that are critical in synchronous buck operating from 12 volt buss converters including Rds(on) and gate charge to minimize losses in the control FET socket. ...

Page 2

... IRF6626 Static @ T = 25°C (unless otherwise specified) J Parameter BV Drain-to-Source Breakdown Voltage DSS ∆ΒV /∆T Breakdown Voltage Temp. Coefficient DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) ∆V /∆T Gate Threshold Voltage Coefficient GS(th Drain-to-Source Leakage Current DSS I Gate-to-Source Forward Leakage ...

Page 3

... Ci= τi/Ri Ci τi/Ri 0.0001 0.001 0. Rectangular Pulse Duration (sec) ‰ T measured with thermocouple incontact with top (Drain) of part. C Š measured at θ ‡ IRF6626 Max. 2.2 1.4 42 270 - 150 Typ. Max. ––– 58 12.5 ––– 20 ––– ––– ...

Page 4

... IRF6626 1000 100 10 2.5V 1 ≤ 60µs PULSE WIDTH Tj = 25°C 0.1 0 Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 1000 15V ≤ 60µs PULSE WIDTH 100 150° 25° -40° Gate-to-Source Voltage (V) Fig 6. Typical Transfer Characteristics 100000 0V MHZ C iss = SHORTED C rss = C gd ...

Page 5

... Fig 13. Threshold Voltage vs. Temperature 100 BOTTOM 13A 100 Starting Junction Temperature (°C) IRF6626 OPERATION IN THIS AREA LIMITED (on) 100µsec 1msec 10msec Ta = 25° 150°C Single Pulse 0.01 0.10 1.00 10. Drain-to-Source Voltage ( 50µA -75 -50 - 100 125 150 Temperature ( ° ...

Page 6

... IRF6626 Current Regulator Same Type as D.U.T. 50KΩ .2µF 12V .3µF D.U. 3mA I G Current Sampling Resistors Fig 15a. Gate Charge Test Circuit D.U 20V 0.01 Ω Fig 16a. Unclamped Inductive Test Circuit V DS D.U Pulse Width < 1µs Duty Factor < 0.1% Fig 17a ...

Page 7

... D.U.T. I Waveform SD Reverse Recovery Body Diode Forward Current + D.U.T. V Waveform DS V Re-Applied + Voltage Body Diode - Inductor Curent Ripple ≤ for Logic Level Devices for N-Channel ® HEXFET Power MOSFETs G = GATE D = DRAIN S = SOURCE IRF6626 P. Period V =10V GS Current di/dt Diode Recovery dv/ Forward Drop ...

Page 8

... IRF6626 DirectFET™ Outline Dimension, ST Outline (Small Size Can, T-Designation). Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs. DirectFET™ Part Marking 8 DIMENSIONS IMPERIAL METRIC MAX MIN ...

Page 9

... DirectFET™ Tape & Reel Dimension (Showing component orientation). NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6626). For 1000 parts on 7" reel, order IRF6626TR1 CODE WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com ...

Page 10

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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