LPC1754FBD80,551 NXP Semiconductors, LPC1754FBD80,551 Datasheet - Page 55

IC ARM CORTEX MCU 128K 80-LQFP

LPC1754FBD80,551

Manufacturer Part Number
LPC1754FBD80,551
Description
IC ARM CORTEX MCU 128K 80-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1754FBD80,551

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
80-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
52
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 6x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
52
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 6 Channel
On-chip Dac
10 bit
Cpu Family
LPC17xx
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
32KB
# I/os (max)
52
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4790
935287913551

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LPC1754FBD80,551
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LPC1754FBD80,551
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NXP Semiconductors
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NXP Semiconductors
Table 15.
C
[1]
LPC1759_58_56_54_52_51
Product data sheet
Symbol
t
t
t
V
t
t
t
t
t
t
r
f
FRFM
FEOPT
FDEOP
JR1
JR2
EOPR1
EOPR2
Fig 20. Differential data-to-EOP transition skew and EOP width
L
CRS
= 50 pF; R
Characterized but not implemented as production test. Guaranteed by design.
T
PERIOD
differential
data lines
Dynamic characteristics: USB pins (full-speed)
pu
= 1.5 k
11.8 USB interface
Parameter
rise time
fall time
differential rise and fall time
matching
output signal crossover voltage
source SE0 interval of EOP
source jitter for differential transition
to SE0 transition
receiver jitter to next transition
receiver jitter for paired transitions
EOP width at receiver
EOP width at receiver
Ω
on D+ to V
n × T
differential data to
crossover point
DD(3V3)
SE0/EOP skew
PERIOD
All information provided in this document is subject to legal disclaimers.
; 3.0 V
+ t
FDEOP
Rev. 6.01 — 11 March 2011
V
DD(3V3)
Conditions
10 % to 90 %
10 % to 90 %
see
see
10 % to 90 %
must reject as
EOP; see
Figure 20
must accept as
EOP; see
Figure 20
t
r
/ t
Figure 20
Figure 20
f
3.6 V.
crossover point
LPC1759/58/56/54/52/51
extended
[1]
[1]
32-bit ARM Cortex-M3 microcontroller
Min
8.5
7.7
-
1.3
160
−2
−18.5
−9
40
82
source EOP width: t
receiver EOP width: t
Typ
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2011. All rights reserved.
Max
13.8
13.7
109
2.0
175
+5
+18.5
+9
-
-
FEOPT
002aab561
EOPR1
, t
EOPR2
55 of 74
Unit
ns
ns
%
V
ns
ns
ns
ns
ns
ns

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