LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 56

• Manufacturer Part Number: LPC2387FBD100,551
• Description: IC ARM7 MCU FLASH 512K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2387FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
• Development Tools By Supplier: OM11013
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 72MHz
• Total Internal Ram Size: 98KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-4322; 935284932551; LPC2387FBD100-S

NXP Semiconductors
LPC2387
Product data sheet
14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
14.5 Standard I/O pin configuration
that belong to a specific C
this table are calculated from the internal parasitic capacitances and the C
from PCB and package are not taken into account.
Table 16.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Figure 25
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
Crystal load capacitance
C
11 pF
13 pF
15 pF
•
•
•
•
•
L
Digital output driver: Open-drain mode enabled/disabled
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Digital input: Repeater mode enabled/disabled
Analog input
shows the possible pin modes for standard I/O pins with analog input function:
Recommended values for the RTC external 32 kHz oscillator C
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 10 February 2011
L
Maximum crystal series
resistance R
< 100 kΩ
< 100 kΩ
< 100 kΩ
. The value of external capacitances C
S
x1
and C
x2
External load capacitors C
18 pF, 18 pF
22 pF, 22 pF
27 pF, 27 pF
should be chosen smaller
Single-chip 16-bit/32-bit MCU
x1
, C
X1
x2
and C
, and C
LPC2387
© NXP B.V. 2011. All rights reserved.
X1
/C
L
X2
. Parasitics
X2
specified in
x3
components
in case of
X1
/C
56 of 64
X2