LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 60
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LPC2387FBD100,551
Manufacturer Part Number
LPC2387FBD100,551
Description
IC ARM7 MCU FLASH 512K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Specifications of LPC2387FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
Development Tools By Supplier
OM11013
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Cpu Family
LPC2000
Device Core
ARM7TDMI-S
Device Core Size
16/32Bit
Frequency (max)
72MHz
Total Internal Ram Size
98KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-4322
935284932551
LPC2387FBD100-S
935284932551
LPC2387FBD100-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2387FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
17. Revision history
Table 18.
LPC2387
Product data sheet
Document ID
LPC2387 v.4
Modifications:
LPC2387 v.3
Modifications:
LPC2387 v.2
LPC2387 v.1
Revision history
Release date
20110210
20081029
20080201
20080114
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Table 3 “Pin
Table 3 “Pin
Table 4 “Limiting
Table 6 “Static
Table 6 “Static
Table 6 “Static
Table 6 “Static
I
Table 6 “Static
Section 2 “Features and
Section 7.2 “On-chip flash programming memory”
Removed text regarding flash endurance minimum specs.
Section 7.23 “RTC and battery
Section 7.24.2
Section 7.24.3 “Wake-up
Section 7.24.4 “Power
Added
Section 7.25.2 “Brownout
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Moved
below
Added USB host/OTG features
Table 4: changed storage temperature range from −40 °C/125 °C to −65 °C/150 °C.
Table 6, V
Table 6, V
Table 6: updated Table note 10.
BATact
; added I
Table 7 “Dynamic
Section 7.24.4.4 “Deep power-down
Section 9 “Thermal
Section 10.1 “Power-down
Section 10.2 “Deep power-down
Section 10.3 “Electrical pin
Section 11.1 “Internal
Section 11.2 “I/O
Section 11.4 “Flash
Section 13 “DAC electrical
Section 14.2 “Crystal oscillator XTAL input and component
Section 14.3 “RTC 32 kHz oscillator component
Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout
Section 14.5 “Standard I/O pin
Section 14.6 “Reset pin
Figure 12 “External clock timing (with an amplitude of at least V
hys
I
, added Table note 8.
All information provided in this document is subject to legal disclaimers.
description”: Added
description”: Added
, moved 0.4 from Typ to Min column.
DD(DCDC)dpd(3V3)
characteristics”: Removed R
characteristics”,
characteristics”: Updated min, typical and max values for oscillator pins.
characteristics”: Updated conditions and typical values for I
characteristics”: Changed I
“PLL”: Changed input clock frequency max to 25 MHz.
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
values”: Changed V
Rev. 4 — 10 February 2011
control”: Added deep power-down information.
pins”.
characteristics”.
benefits”: Added deep power-down information.
timer”: Added deep power-down information.
detection”: Changed V
characteristics”.
memory”.
oscillators”.
and I
RAM”: Added deep power-down information.
Table note
configuration”.
Table note 9
Table note 10
characteristics”.
mode”.
characteristics”.
BAT
ESD
configuration”.
.
mode”.
min/max to −2500/+2500.
2
14: Changed value from 18 to 33.
C-bus V
pu
mode”.
.
for XTAL1 and XTAL2 pins.
Change notice
-
-
-
-
for RTCX1 and RTCX2 pins.
DD(3V3)
“On-chip flash programming memory”:
hys
typical from 0.5V
selection”.
to V
Single-chip 16-bit/32-bit MCU
DD(DCDC)(3V3)
selection”.
Supersedes
LPC2387 v.3
LPC2387 v.2
LPC2387 v.1
-
i(RMS)
DD
LPC2387
.
© NXP B.V. 2011. All rights reserved.
guidelines”.
DD(DCDC)pd(3V3)
to 0.05V
= 200 mV)”
DD
.
60 of 64
,
to