LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 60

• Manufacturer Part Number: LPC2387FBD100,551
• Description: IC ARM7 MCU FLASH 512K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2387FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
• Development Tools By Supplier: OM11013
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 72MHz
• Total Internal Ram Size: 98KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-4322; 935284932551; LPC2387FBD100-S

NXP Semiconductors
17. Revision history
Table 18.
LPC2387
Product data sheet
Document ID
LPC2387 v.4
Modifications:
LPC2387 v.3
Modifications:
LPC2387 v.2
LPC2387 v.1
Revision history
Release date
20110210
20081029
20080201
20080114
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Table 3 “Pin
Table 3 “Pin
Table 4 “Limiting
Table 6 “Static
Table 6 “Static
Table 6 “Static
Table 6 “Static
I
Table 6 “Static
Section 2 “Features and
Section 7.2 “On-chip flash programming memory”
Removed text regarding flash endurance minimum specs.
Section 7.23 “RTC and battery
Section 7.24.2
Section 7.24.3 “Wake-up
Section 7.24.4 “Power
Added
Section 7.25.2 “Brownout
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Added
Moved
below
Added USB host/OTG features
Table 4: changed storage temperature range from −40 °C/125 °C to −65 °C/150 °C.
Table 6, V
Table 6, V
Table 6: updated Table note 10.
BATact
; added I
Table 7 “Dynamic
Section 7.24.4.4 “Deep power-down
Section 9 “Thermal
Section 10.1 “Power-down
Section 10.2 “Deep power-down
Section 10.3 “Electrical pin
Section 11.1 “Internal
Section 11.2 “I/O
Section 11.4 “Flash
Section 13 “DAC electrical
Section 14.2 “Crystal oscillator XTAL input and component
Section 14.3 “RTC 32 kHz oscillator component
Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout
Section 14.5 “Standard I/O pin
Section 14.6 “Reset pin
Figure 12 “External clock timing (with an amplitude of at least V
hys
I
, added Table note 8.
All information provided in this document is subject to legal disclaimers.
description”: Added
description”: Added
, moved 0.4 from Typ to Min column.
DD(DCDC)dpd(3V3)
characteristics”: Removed R
characteristics”,
characteristics”: Updated min, typical and max values for oscillator pins.
characteristics”: Updated conditions and typical values for I
characteristics”: Changed I
“PLL”: Changed input clock frequency max to 25 MHz.
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
values”: Changed V
Rev. 4 — 10 February 2011
control”: Added deep power-down information.
pins”.
characteristics”.
benefits”: Added deep power-down information.
timer”: Added deep power-down information.
detection”: Changed V
characteristics”.
memory”.
oscillators”.
and I
RAM”: Added deep power-down information.
Table note
configuration”.
Table note 9
Table note 10
characteristics”.
mode”.
characteristics”.
BAT
ESD
configuration”.
.
mode”.
min/max to −2500/+2500.
2
14: Changed value from 18 to 33.
C-bus V
pu
mode”.
.
for XTAL1 and XTAL2 pins.
Change notice
-
-
-
-
for RTCX1 and RTCX2 pins.
DD(3V3)
“On-chip flash programming memory”:
hys
typical from 0.5V
selection”.
to V
Single-chip 16-bit/32-bit MCU
DD(DCDC)(3V3)
selection”.
Supersedes
LPC2387 v.3
LPC2387 v.2
LPC2387 v.1
-
i(RMS)
DD
LPC2387
.
© NXP B.V. 2011. All rights reserved.
guidelines”.
DD(DCDC)pd(3V3)
to 0.05V
= 200 mV)”
DD
.
60 of 64
,
to