MC56F8002VWL Freescale Semiconductor, MC56F8002VWL Datasheet - Page 42

• Manufacturer Part Number: MC56F8002VWL
• Description: DSC 12K FLASH 32MHZ 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8002VWL

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 12KB (6K x 16)
• Program Memory Type: FLASH
• Ram Size: 1K x 16
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 15x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 28-SOIC
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Instruction Set Architecture: Dual Harvard
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 40
• Data Ram Size: 2 KB
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8006DEMO, APMOTOR56F8000E
• Interface Type: LIN, I2C, SCI, SPI
• Minimum Operating Temperature: - 40 C
• For Use With: APMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Specifications
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete
DC parametric and functional testing is performed per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
8.3
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take P
the difference between actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
42
Thermal Characteristics
1
Parameter is achieved by design characterization on a small sample size from typical devices un-
der typical conditions unless otherwise noted.
ESD for Charge Device Model (CDM)
ESD for Human Body Model (HBM)
Latch-up current at T
Latch-up
Machine
ESD for Machine Model (MM)
Human
Junction to ambient
Junction to ambient
Junction to ambient
Model
Natural convection
Natural convection
Body
Characteristic
(@200 ft/min)
Characteristic
Table 15. 28SOIC Package Thermal Characteristics
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 3
Maximum Input Voltage Limit
Minimum inpUt Voltage Limit
Number of Pulses per Pin
Number of Pulses per Pin
Table 13. ESD and Latch-up Test Conditions
A
Storage Capacitance
Storage Capacitance
Table 14. 56F8006/56F8002 ESD Protection
= 85
Series Resistance
Series Resistance
1
Description
o
C (I
LAT
SS
Single layer board
Single layer board
Four layer board
or V
)
Comments
(2s2p)
DD
(1s)
(1s)
and multiply by the pin current for each I/O pin. Except in cases of
2000
Min
200
750
100
Symbol
R1
R1
—
—
C
C
Symbol
R
R
R
Typ
JMA
JMA
—
—
—
JA
I/O
into account in power calculations, determine
SS
or V
Value
1500
–2.5
100
200
7.5
(LQFP)
3
0
3
Value
Max
DD
—
—
—
70
47
55
will be very small.
Freescale Semiconductor
Unit
pF
pF
V
V
Unit
°C/W
°C/W
°C/W
Unit
mA
V
V
V