MC56F8002VWL Freescale Semiconductor, MC56F8002VWL Datasheet - Page 43

• Manufacturer Part Number: MC56F8002VWL
• Description: DSC 12K FLASH 32MHZ 28-SOIC
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8002VWL

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 12KB (6K x 16)
• Program Memory Type: FLASH
• Ram Size: 1K x 16
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 15x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 28-SOIC
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Instruction Set Architecture: Dual Harvard
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 40
• Data Ram Size: 2 KB
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8006DEMO, APMOTOR56F8000E
• Interface Type: LIN, I2C, SCI, SPI
• Minimum Operating Temperature: - 40 C
• For Use With: APMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Freescale Semiconductor
Junction to package top
Junction to package top
Junction to package top
Junction-to-ambient thermal resistance determined per JEDEC JESD51–3 and JESD51–6.
Thermal test board meets JEDEC specification for this package.
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Natural convection
Natural convection
Natural convection
Natural convection
Junction to board
Junction to board
Junction to board
Junction to case
Junction to case
Junction to case
Characteristic
Characteristic
Characteristic
(@200 ft/min)
(@200 ft/min)
(@200 ft/min)
(@200 ft/min)
(@200 ft/min)
Table 16. 32LQFP Package Thermal Characteristics
Table 17. 48LQFP Package Thermal Characteristics
Table 15. 28SOIC Package Thermal Characteristics
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 3
Natural Convection
Natural Convection
Natural Convection
Single layer board
Single layer board
Single layer board
Single layer board
Four layer board
Four layer board
Four layer board
Four layer board
Four layer board
Comments
Comments
Comments
(2s2p)
(2s2p)
(2s2p)
(2s2p)
(2s2p)
(1s)
(1s)
(1s)
(1s)
NOTE
Symbol
Symbol
Symbol
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
JMA
JMA
JMA
JMA
JMA
JMA
JMA
JT
JT
JT
JC
JC
JC
JB
JA
JB
JA
JB
(LQFP)
(LQFP)
(LQFP)
Value
Value
Value
42
23
26
84
56
70
49
33
20
79
55
66
48
34
20
9
4
4
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Unit
Specifications
43