DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 463
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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12. Clear the IRIC flag to 0. Write 0 to ACKE in ICCR, to clear received ACKB contents to 0.
SCL
(Master output)
SDA
(Master output)
SDA
(Slave output)
IRIC
IRTR
ICDRT
ICDRS
User processing
Figure 14.8 Example of Master Transmit Mode Operation Timing (MLS = WAIT = 0)
Write 0 to BBSY and SCP in ICCR. This changes SDA from low to high when SCL is high,
and generates the stop condition.
Note: Do not write data
to ICDR.
[4] Write BBSY = 1
Start condition
generated
and SCP = 0
(start condition
issued)
Section 14 I
Interrupt
request
[5]
Address + R/W
Address + R/W
[6] ICDR write
Bit 7
2
1
C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
Bit 6
2
Bit 5
3
Slave address
Bit 4
[6] IRIC clearance
4
Bit 3
5
Bit 2
6
Rev. 5.00 Sep. 01, 2009 Page 411 of 656
Bit 1
7
Bit 0
R/W
8
[9] ICDR write
[7]
9
A
Interrupt
request
Data 1
REJ09B0071-0500
Data 1
[9] IRIC clearance
Bit 7
1
Data 1
Bit 6
2
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