DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 659
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Notes: 1. If the A/D and D/A converters and DTMF generation circuit are not used, do not leave
Item
Analog
power supply
current
Reference
current
RAM standby voltage
2. Current consumption values are for V
3. The values are for V
4. I
the AVCC, Vref, and AVSS pins open. Apply a voltage 4.0 to 5.5 V to the AVCC and
Vref pins by connecting them to V
output pins unloaded and the on-chip pull-up resistors in the off state.
I
V
I
V
CC
CC
CC
CC
CC
depends on V
max. = 4.0 (mA) + 0.64 (mA/V) × Vcc + 0.75 (mA/MHz) × f + 0.15 (mA/(MHz × V)) ×
max. = 3.0 (mA) + 0.60 (mA/V) × Vcc + 0.60 (mA/MHz) × f + 0.10 (mA/(MHz × V)) ×
During A/D
conversion,
D/A conversion,
DTMF output
Waiting for A/D
conversion,
D/A conversion,
DTMF stopped
During A/D
conversion,
D/A conversion
Waiting for A/D
conversion,
D/A conversion
× f (normal operation)
× f (sleep mode)
CC
and f as follows (reference):
Symbol Min.
Al
Al
V
RAM
RAM
CC
CC
≤ V
CC
⎯
⎯
⎯
⎯
2.0
< 4.0 V, V
CC
Typ.
1.5
0.01
1.5
0.01
⎯
, for instance. Set V
IH
IH
min. = V
min. = V
Rev. 5.00 Sep. 01, 2009 Page 607 of 656
Max.
2.5
5.0
2.2
5.0
⎯
CC
CC
– 0.2 V, V
Section 25 Electrical Characteristics
– 0.2, and V
ref
≤ AV
Unit
mA
μA
mA
μA
V
IL
max. = 0.2 V with all
CC
.
IL
max. = 0.2 V.
Test Conditions
REJ09B0071-0500
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