PIC16C770-I/P Microchip Technology, PIC16C770-I/P Datasheet - Page 99
![IC MCU CMOS A/D 2K 20MHZ 20-DIP](/photos/12/13/121303/150-20-dip_sml.jpg)
PIC16C770-I/P
Manufacturer Part Number
PIC16C770-I/P
Description
IC MCU CMOS A/D 2K 20MHZ 20-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16C770-ISO.pdf
(220 pages)
2.PIC16C770-ISO.pdf
(6 pages)
3.PIC16C770-ISO.pdf
(8 pages)
Specifications of PIC16C770-I/P
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Oscillator Type
Internal
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
15
Program Memory Type
OTP
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 6x12b
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Controller Family/series
PIC16C
No. Of I/o's
16
Ram Memory Size
256Byte
Cpu Speed
20MHz
No. Of Timers
3
No. Of
RoHS Compliant
Core
PIC
Processor Series
PIC16C
Data Bus Width
8 bit
Maximum Clock Frequency
20 MHz
Data Ram Size
256 B
Data Rom Size
256 B
On-chip Adc
6 bit
Number Of Programmable I/os
16
Number Of Timers
3 bit
Operating Supply Voltage
2.5 V to 5.5 V
Mounting Style
Through Hole
Height
3.3 mm
Interface Type
I2C, SPI, SSP
Length
26.16 mm
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA16XP200 - ADAPTER ICE 20DIP/SOIC/SSOPAC164028 - MODULE SKT PROMATEII 20SOIC/DIP
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
PIC16C770I/P
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9.2.17.2
During a Repeated START condition, a bus collision
occurs if:
a)
b)
When the master module de-asserts SDA and the pin
is allowed to float high, the BRG is loaded with
SSPADD<6:0>, and counts down to ‘0’. The SCL pin is
then de-asserted, and when sampled high, the SDA pin
is sampled. If SDA is low, a bus collision has occurred
(i.e., another master is attempting to transmit a data
FIGURE 9-27:
FIGURE 9-28:
2002 Microchip Technology Inc.
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to trans-
mit a data ’1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
BUS COLLISION DURING A REPEATED
START CONDITION
’0’
’0’
’0’
’0’
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
Set BCLIF. Release SDA and SCL
Advance Information
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL
’0’). If however SDA is sampled high, then the BRG is
reloaded and begins counting. If SDA goes from high to
low before the BRG times out, no bus collision occurs,
because no two masters can assert SDA at exactly the
same time.
If, however, SCL goes from high to low before the BRG
times out and SDA has not already been asserted, then
a bus collision occurs. In this case, another master is
attempting to transmit a data ’1’ during the Repeated
START condition.
If at the end of the BRG time-out both SCL and SDA are
still high, the SDA pin is driven low, the BRG is
reloaded, and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated START condition is com-
plete (Figure 9-27).
PIC16C717/770/771
T
Cleared in software
BRG
Interrupt cleared
in software
’0’
’0’
DS41120B-page 97
’0’
’0’
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