ATMEGA324PA-AU Atmel, ATMEGA324PA-AU Datasheet - Page 251

• Manufacturer Part Number: ATMEGA324PA-AU
• Description: MCU AVR 32K FLASH 20MHZ 40-TQFP
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA324PA-AU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: ATMEGA32x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: 2-Wire, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATQT600
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: ATmega
• Device Core: AVR
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 2KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: TQFP
• Package: 44TQFP
• Family Name: ATmega
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Controller Family/series: AVR MEGA
• No. Of I/o's: 32
• Eeprom Memory Size: 1KB
• Ram Memory Size: 2KB
• Cpu Speed: 20MHz
• Rohs Compliant: Yes
• For Use With: ATSTK600 - DEV KIT FOR AVR/AVR32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

22.7.2
22.7.3
8272A–AVR–01/10
Analog Noise Canceling Techniques
Offset Compensation Schemes
Digital circuitry inside and outside the device generates EMI which might affect the accuracy of
analog measurements. If conversion accuracy is critical, the noise level can be reduced by
applying the following techniques:
Figure 22-9. ADC Power Connections
The gain stage has a built-in offset cancellation circuitry that nulls the offset of differential mea-
surements as much as possible. The remaining offset in the analog path can be measured
directly by selecting the same channel for both differential inputs. This offset residue can be then
subtracted in software from the measurement results. Using this kind of software based offset
correction, offset on any channel can be reduced below one LSB.
164A/164PA/324A/324PA/644A/644PA/1284/1284P
a. Keep analog signal paths as short as possible. Make sure analog tracks run over the
b. The AVCC pin on the device should be connected to the digital V
c. Use the ADC noise canceler function to reduce induced noise from the CPU.
d. If any ADC port pins are used as digital outputs, it is essential that these do not
analog ground plane, and keep them well away from high-speed switching digital
tracks.
via an LC network as shown in
switch while a conversion is in progress.
Figure
22-9.
PA4 (ADC4)
PA5 (ADC5)
PA6 (ADC6)
PA7 (ADC7)
AREF
GND
AVCC
PC7
CC
supply voltage
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