ATMEGA324PA-AU Atmel, ATMEGA324PA-AU Datasheet - Page 263

MCU AVR 32K FLASH 20MHZ 40-TQFP

ATMEGA324PA-AU

Manufacturer Part Number
ATMEGA324PA-AU
Description
MCU AVR 32K FLASH 20MHZ 40-TQFP
Manufacturer
Atmel
Series
AVR® ATmegar

Specifications of ATMEGA324PA-AU

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Processor Series
ATMEGA32x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATQT600
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
ATmega
Device Core
AVR
Device Core Size
8b
Frequency (max)
20MHz
Total Internal Ram Size
2KB
# I/os (max)
32
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
1.8V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
TQFP
Package
44TQFP
Family Name
ATmega
Maximum Speed
20 MHz
Operating Supply Voltage
2.5|3.3|5 V
Controller Family/series
AVR MEGA
No. Of I/o's
32
Eeprom Memory Size
1KB
Ram Memory Size
2KB
Cpu Speed
20MHz
Rohs Compliant
Yes
For Use With
ATSTK600 - DEV KIT FOR AVR/AVR32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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23.4
8272A–AVR–01/10
TAP Controller
Figure 23-2. TAP Controller State Diagram
The TAP controller is a 16-state finite state machine that controls the operation of the Boundary-
scan circuitry, JTAG programming circuitry, or On-chip Debug system. The state transitions
depicted in
transition) at the time of the rising edge at TCK. The initial state after a Power-on Reset is Test-
Logic-Reset.
As a definition in this document, the LSB is shifted in and out first for all Shift Registers.
Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG interface is:
• At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter the Shift
164A/164PA/324A/324PA/644A/644PA/1284/1284P
Instruction Register – Shift-IR state. While in this state, shift the four bits of the JTAG
instructions into the JTAG Instruction Register from the TDI input at the rising edge of TCK.
The TMS input must be held low during input of the 3 LSBs in order to remain in the Shift-IR
state. The MSB of the instruction is shifted in when this state is left by setting TMS high. While
the instruction is shifted in from the TDI pin, the captured IR-state 0x01 is shifted out on the
TDO pin. The JTAG Instruction selects a particular Data Register as path between TDI and
TDO and controls the circuitry surrounding the selected Data Register.
1
0
Figure 23-2
Test-Logic-Reset
Run-Test/Idle
0
depend on the signal present on TMS (shown adjacent to each state
1
1
0
Select-DR Scan
Capture-DR
Update-DR
Pause-DR
Exit1-DR
Exit2-DR
Shift-DR
1
0
0
1
0
1
1
0
1
1
0
0
1
0
Select-IR Scan
Capture-IR
Update-IR
Pause-IR
Exit1-IR
Exit2-IR
Shift-IR
1
0
0
1
0
1
1
0
1
1
0
0
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