P89CV51RD2FBC,557 NXP Semiconductors, P89CV51RD2FBC,557 Datasheet - Page 59

• Manufacturer Part Number: P89CV51RD2FBC,557
• Description: IC 80C51 MCU FLASH 64K 44-TQFP
• Manufacturer: NXP Semiconductors
• Series: 89Cr

Specifications of P89CV51RD2FBC,557

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: P89CV5x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• Cpu Family: 89C
• Device Core: 80C51
• Device Core Size: 8b
• Frequency (max): 40MHz
• Total Internal Ram Size: 1KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4257; 935284103557; P89CV51RD2FBC

NXP Semiconductors
7. Limiting values
Table 53.
In accordance with the Absolute Maximum Rating System (IEC 60134). Parameters are valid over operating temperature
range unless otherwise specified; all voltages are with respect to V
8. Static characteristics
Table 54.
T
P89CV51RB2_RC2_RD2_3
Product data sheet
Symbol
T
T
V
V
I
P
Symbol
n
t
I
V
V
V
V
I
I
I
OL(I/O)
ret(fl)
latch
IL
THL
LI
amb
endu(fl)
amb(bias)
stg
I
n
tot(pack)
th(HL)
th(LH)
OL
OH
= 40 C to +85 C; V
Parameter
endurance of flash memory
flash memory retention time JEDEC Standard A103
I/O latch-up current
HIGH-LOW threshold
voltage
LOW-HIGH threshold
voltage
LOW-level output voltage
HIGH-level output voltage
LOW-level input current
HIGH-LOW transition
current
input leakage current
Limiting values
Static characteristics
Parameter
bias ambient temperature
storage temperature
input voltage
voltage on any other pin
LOW-level output current per
input/output pin
total power dissipation (per package) based on package heat
DD
= 4.5 V to 5.5 V; V
Conditions
JEDEC Standard A117
JEDEC Standard 78
except XTAL1, RST
V
except PSEN, ALE
V
V
ports 1, 2, 3, 4
V
External bus mode, ALE,
PSEN
V
V
0.45 V < V
port 0
0 V < V
DD
DD
DD
DD
I
I
I
I
I
I
= 0.4 V; ports 1, 2, 3, 4
= 2 V; ports 1, 2, 3, 4
OL
OL
OH
OH
= 4.5 V;
= 4.5 V; ALE, PSEN
= 4.5 V;
= 4.5 V; port 0 in
= 1.6 mA
= 3.2 mA
= 30 A
= 3.2 mA
SS
I
Rev. 03 — 25 August 2009
< 6 V
= 0 V.
I
Conditions
on EA pin to V
except V
V
transfer, not device power
consumption
< V
DD
DD
SS
0.3 V;
; with respect to
SS
SS
unless otherwise noted.
P89CV51RB2/RC2/RD2
[2][3][4]
[1]
[1]
[1]
[5]
[6]
Min
10000
100
100 + I
0.2V
-
-
V
V
-
-
-
0.5
1
DD
DD
DD
0.7
0.7
DD
+ 0.9 -
Min
-
-
55
65
0.5
0.5
Typ
-
-
-
-
-
-
-
-
-
-
-
-
80C51 with 1 kB RAM, SPI
Max
-
-
-
+0.2V
V
0.4
0.45
-
-
10
75
650
10
DD
Max
+125
+150
+14
V
15
1.5
© NXP B.V. 2009. All rights reserved.
DD
+ 0.5
DD
+ 0.5
0.1
Unit
cycles
years
mA
V
V
V
V
V
V
Unit
V
V
mA
W
59 of 76
C
C
A
A
A
A