SAK-XC888CLM-8FFA 5V AC Infineon Technologies, SAK-XC888CLM-8FFA 5V AC Datasheet - Page 140

• Manufacturer Part Number: SAK-XC888CLM-8FFA 5V AC
• Description: IC MCU 8BIT FLASH 64-LQFP
• Manufacturer: Infineon Technologies
• Series: XC8xxr

Specifications of SAK-XC888CLM-8FFA 5V AC

• Core Processor: XC800
• Core Size: 8-Bit
• Speed: 103.2MHz
• Connectivity: CAN, LIN, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 48
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.75K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LFQFP
• Data Bus Width: 8 bit
• Data Ram Size: 1.75 KB
• Interface Type: UART, SSC
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 4
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• For Use With: B158-H8743-X-X-7600IN - KIT STARTER XC886/888
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: SP000210982

5
Chapter 5
5.1
Table 1
Table 1
Parameter
PG-TQFP-48 (XC886)
Thermal resistance junction
case
Thermal resistance junction
lead
PG-TQFP-64 (XC888)
Thermal resistance junction
case
Thermal resistance junction
lead
1) The thermal resistances between the case and the ambient (
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
Data Sheet
combined with the thermal resistances between the junction and the case (
(
(
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
R
TJL
TJA
) given above, in order to calculate the total thermal resistance between the junction and the ambient
). The thermal resistances between the case and the ambient (
provides the thermal characteristics of the package used in XC886 and XC888.
provides the information of the XC886/888 package and reliability section.
Package and Quality Declaration
Package Parameters
Thermal Characteristics of the Packages
Symbol
R
R
R
R
TJC
TJL
TJC
TJL
CC -
CC -
CC -
CC -
Min.
133
Limit Values
R
TCA
Package and Quality Declaration
) , the lead and the ambient (
13
32.5
12.6
33.4
Max.
R
TCA
T
), the lead and the ambient (
J
=
R
T
TJC
A
+
R
Unit
K/W
K/W
K/W
K/W
), the junction and the lead
TJA
XC886/888CLM
×
P
D
, where the
Notes
1)2)
1)2)
1)2)
1)2)
V1.2, 2009-07
R
-
TLA
) are to be
R
R
TJA
R
TLA
TJA
is
)