SAF-XE167F-96F80L AC Infineon Technologies, SAF-XE167F-96F80L AC Datasheet - Page 121

• Manufacturer Part Number: SAF-XE167F-96F80L AC
• Description: IC MCU 16BIT FLASH 144-LQFP
• Manufacturer: Infineon Technologies
• Series: XE16xr

Specifications of SAF-XE167F-96F80L AC

• Core Processor: C166SV2
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: I²S, POR, PWM, WDT
• Number Of I /o: 118
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 82K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFQFP
• Data Bus Width: 16 bit
• Data Ram Size: 64 KB
• Interface Type: CAN
• Maximum Clock Frequency: 66 MHz
• Number Of Programmable I/os: 118
• Number Of Timers: 11
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: SP000450816

5.2
When operating the XE167 in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 125 °C.
The difference between junction temperature and ambient temperature is determined by
∆T = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(see
OH
+
) ×
P
Section
IODYN
I
OH
) + Σ(
) ×
R
4.2.3).
ΘJA
V
OL
×
I
OL
119
)
R
ΘJA
” quantifies these parameters. The
XE166 Family Derivatives
Package and Reliability
P
IODYN
V2.1, 2008-08
) depends
XE167x