IFX27001TF V50 Infineon Technologies, IFX27001TF V50 Datasheet - Page 6

• Manufacturer Part Number: IFX27001TF V50
• Description: IC REG LDO 5.0V 1.0A TO252-3
• Manufacturer: Infineon Technologies

Specifications of IFX27001TF V50

• Regulator Topology: Positive Fixed
• Voltage - Output: 5V
• Voltage - Input: Up to 40V
• Voltage - Dropout (typical): 1.3V @ 1A
• Number Of Regulators: 1
• Current - Output: 1A (Max)
• Current - Limit (min): 1A
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-252-2, DPak (2 Leads + Tab), TO-252AA, SC-63
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IFX27001TF V50INTR

4.2
Pos.
4.2.1
4.2.2
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
Pos.
4.3.1
4.3.2
4.3.3
4.3.4
1) Not subject to production test, specified by design.
2) Specified
3) Specified
Data Sheet
PG-TO252-3
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm
characteristics are specified within the conditions given in the Electrical Characteristics table.
to www.jedec.org.
Parameter
Junction to Case
Junction to Ambient
Parameter
Input voltage
Junction temperature
R
R
Functional Range
Thermal Resistance
thJA
thJA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product
1)
1)
Symbol
V
T
j
I
Symbol
R
R
R
R
thJC
thJA
thJA
thJA
6
Min.
V
-40
Min.
–
–
–
–
3
I
board with 1 copper layer (1 x 70µm Cu).
+ V
Limit Values
DR
Limit Values
Typ.
4
27
57
42
Max.
40
125
Max.
–
–
–
–
General Product Characteristics
Unit Remarks
V
°C
Unit
K/W
K/W
K/W
K/W
–
Rev. 1.01, 2009-10-19
Conditions
measured to heat
slug
2)
300 mm² heatsink
area
600 mm² heatsink
area
3)
3)
IFX27001