SC16C750IA44,512 NXP Semiconductors, SC16C750IA44,512 Datasheet - Page 43

• Manufacturer Part Number: SC16C750IA44,512
• Description: IC UART 64BYTE 44PLCC
• Manufacturer: NXP Semiconductors

Specifications of SC16C750IA44,512

• Number Of Channels: 1, UART
• Fifo's: 64 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-PLCC
• Voltage: 2.25 V ~ 5.5 V
• Transmit Fifo: 64Byte
• Receive Fifo: 64Byte
• Transmitter And Receiver Fifo Counter: Yes
• Package Type: PLCC
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 44
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 935270053512; SC16C750IA44; SC16C750IA44

Philips Semiconductors
13. Revision history
Table 28:
9397 750 11623
Product data
Rev Date
04
03
02
01
20030620
20030314
20021211
20020904
Revision history
CPCN
-
-
-
-
[3]
[4]
[5]
[6]
[7]
Description
Product data (9397 750 11623); ECN 853-2367 30035 of 16 June 2003.
Modifications:
Product data (9397 750 11203); ECN 853-2367 29619 of 07 March 2003.
Product data (9397 750 10797); ECN 853-2367 29261 of 06 December 2002.
Product data (9397 750 10149); ECN 853-2367 28865 of 04 September 2002.
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Figure 4 “Crystal oscillator connection.” on page
added connection with resistor.
Rev. 04 — 20 June 2003
10 C measured in the atmosphere of the reflow
12: changed capacitors’ values and
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
UART with 64-byte FIFO
SC16C750
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