FMPA2151 Fairchild Semiconductor, FMPA2151 Datasheet

FMPA2151

Manufacturer Part Number

FMPA2151

Description

IC POWER AMP MOD DUAL 16-LCC 4X4

Manufacturer

Fairchild Semiconductor

Type

Power Amplifierr

Datasheets

1.FMPA2151.pdf (6 pages)

2.FMPA2151.pdf (5 pages)

Specifications of FMPA2151

Current - Supply

170mA

Frequency

2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.9GHz

Gain

31dB

P1db

27dBm

Package / Case

16-LCC

Rf Type

802.11/Wi-Fi, WLAN

Voltage - Supply

3V ~ 3.6V

Number Of Channels

Frequency (max)

5.9GHz

Power Supply Requirement

Single

Single Supply Voltage (min)

Single Supply Voltage (typ)

3.3V

Single Supply Voltage (max)

3.6V

Package Type

LLCC

Dual Supply Voltage (min)

Not RequiredV

Dual Supply Voltage (typ)

Not RequiredV

Dual Supply Voltage (max)

Not RequiredV

Supply Current

500mA

Operating Temperature Classification

Industrial

Operating Temp Range

-40C to 85C

Pin Count

Mounting

Surface Mount

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Noise Figure

Test Frequency

Lead Free Status / Rohs Status

Compliant

Other names

FMPA2151TR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FMPA2151

Manufacturer:

NXP

Quantity:

840

Company:

H&T Electronics

Part Number:

FMPA2151

Quantity:

300

Current page: 1 of 5
Download datasheet (521Kb)

FMPA2151 Rev. E

FMPA2151

2.4–2.5GHz and 4.9–5.9GHz Dual Band Linear Power

Ampliﬁer Module

Features

Device (4 x 4 x 1.4mm)

Electrical Characteristics

(with 176 µs burst time, 100 µs idle time) 54 Mbps Data Rate, 16.7 MHz Bandwidth

Notes:

1. V

2. Percentage includes system noise floor of EVM = 0.8%.

3. Measured at PIN at which Spectral Mask Compliance is satisfied. Two-sample windowing length applied.

Parameter

Frequency

Collector Supply Voltage

Mirror Supply Voltage (PA ON 2.4)

Mirror Supply Current (PA ON 2.4)

Gain

Average Packet Current @ +19dBm Pout

EVM @ +19dBm Pout

Detector Output @ +19dBm Pout

Detector Output @ +7dBm Pout

POUT Spectral Mask Compliance

Dual band operation in a single package design

Integrated bias bypass

>33dB modulated gain 2.4 to 2.5GHz band

>33dB modulated gain 4.9 to 5.9GHz band

3.0% EVM at 19dBm modulated power out (2.4GHz)

3.5% EVM at 19dBm modulated power out (5.5GHz)

3.3V positive supply operation

Separate integrated power detectors with 20dB

dynamic range

16 pin 4 x 4 x 1.4mm leadless package

Internally matched to 50 and DC blocked RF

input/output

Optimized for use in 802.11a/b/g applications

= 3.3V, PA ON 2.4 = 3.3V, T

(2)

(3)

(1)

= 25°C, PA is constantly biased, 50 system.

802.11g (2.4-2.5 GHz) OFDM Modulation

Min.

2.4

3.0

2.6

General Description

The FMPA2151 is a dual frequency band power ampliﬁer

module

applications in the 2.4 to 2.5GHz and the 4.90 to 5.9GHz

frequency bands. The 16 pin 4 x 4 x 1.4 mm package with

internal matching on both input and output to 50

minimizes next level PCB space and allows for simpliﬁed

integration. Only two external bias bypass capacitors are

required. The two on-chip detectors provide power

sensing capability. The PA’s low power consumption and

excellent linearity are achieved using our InGaP

Heterojunction Bipolar Transistor (HBT) technology.

Complimentary pin out available with part number

FMPA2153 for MIMO applications.

Typ.

designed

+20

140

600

280

3.3

3.0

0.1

3.0

for

Max.

high

2.5

3.6

performance

February 2007

www.fairchildsemi.com

Units

GHz

dBm

WLAN

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FMPA2151 Summary of contents

Page 1

... Measured at PIN at which Spectral Mask Compliance is satisfied. Two-sample windowing length applied. ©2006 Fairchild Semiconductor Corporation FMPA2151 Rev. E General Description The FMPA2151 is a dual frequency band power ampliﬁer module designed applications in the 2.4 to 2.5GHz and the 4.90 to 5.9GHz frequency bands. The 16 pin 1.4 mm package with internal matching on both input and output to 50 minimizes next level PCB space and allows for simpliﬁ ...

Page 2

... PA ON 5.5 = 3.3V Percentage includes system noise floor of EVM = 0.8%. 3. Measured at PIN at which Spectral Mask Compliance is satisfied. Two-sample windowing length applied permanent damage with one parameter set at extreme limit. Other parameters set to typical values. FMPA2151 Rev. E (1) 802.11a OFDM Modulation Min. Typ. ...

Page 3

... Schematic 5.5 VCC2 5.5 Package Outline I/O 1 INDICATOR 1 FRONT VIEW SEE DETAIL A 1 0.650 BOTTOM VIEW FMPA2151 Rev. E VCC1 2.4 VDET 2 OUT 2 OUT 5 VDET 5.5 TOP VIEW XYTT 6 2151 1.40 Max. 2 0.650 0.30 4.00 0.10 2.70 2.70 4.00 0.10 ...

Page 4

... FMPA2151 Rev. E Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. Reflow Profile • Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A maximum heating rate is 3° ...

Page 5

... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete FMPA2151 Rev. E OCX™ SILENT SWITCHER OCXPro™ SMART START™ ® OPTOLOGIC SPM™ OPTOPLANAR™ ...

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