BGA 758L7 E6327 Infineon Technologies, BGA 758L7 E6327 Datasheet - Page 5

• Manufacturer Part Number: BGA 758L7 E6327
• Description: RF Amplifier RF SILICON MMIC
• Manufacturer: Infineon Technologies
• Type: Silicon Germanium MMICr

Specifications of BGA 758L7 E6327

• Mounting Style: SMD/SMT
• Operating Frequency: 5 GHz to 6 GHz
• P1db: - 3.5 dBm
• Noise Figure: 1.3 dB
• Operating Supply Voltage: 4 V
• Supply Current: 7 mA
• Maximum Power Dissipation: 48 mW
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Package / Case: TSLP-7-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BGA758L7E6327XT

List of Figures
Figure 1
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Figure 5
Figure 6
Figure 7
Preliminary Data Sheet
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Cross-section of Application Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package Outline TSLP-7-8 (side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Footprint TSLP-7-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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Revision 1.0, 2010-02-22
List of Figures
BGA758L7