FDMC2514SDC Fairchild Semiconductor, FDMC2514SDC Datasheet - Page 3

• Manufacturer Part Number: FDMC2514SDC
• Description: MOSFET Power 25V NChan Dual Cool PowerTrench SyncFET
• Manufacturer: Fairchild Semiconductor

Specifications of FDMC2514SDC

• Gate Charge Qg: 31 nC
• Minimum Operating Temperature: - 55 C
• Configuration: Dual
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 3.6 mOhms
• Forward Transconductance Gfs (max / Min): 122 S
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 24 A
• Power Dissipation: 3 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Package / Case: Power 33
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

©2010 Fairchild Semiconductor Corporation
FDMC2514SDC Rev.C2
Thermal Characteristics
NOTES:
1. R
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
5. I
R
R
R
R
R
R
R
R
R
R
R
R
R
R
by the user's board design.
θJC
θJC
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
SD
AS
θJA
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
≤ 22.5 A, di/dt ≤ 200 A/μs, V
of 84 mJ is based on starting T
is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
DD
≤ BV
J
= 25
DSS
2
°
pad of 2 oz copper
C, L = 1 mH, I
, Starting T
a. 42 °C/W when mounted on
a 1 in
2
J
pad of 2 oz copper
= 25
AS
2
= 13 A, V
pad of 2 oz copper
o
C.
2
pad of 2 oz copper
DD
= 23 V, V
GS
= 10 V. 100% test at L = 0.3 mH, I
3
2
pad of 2 oz copper
2
pad of 2 oz copper
(Bottom Drain)
(Top Source)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
(Note 1e)
(Note 1g)
(Note 1h)
(Note 1k)
(Note 1f)
(Note 1i)
(Note 1j)
(Note 1l)
θJC
AS
is guaranteed by design while R
= 20 A.
b. 105 °C/W when mounted on
a minimum pad of 2 oz copper
105
5.8
2.1
42
29
40
19
23
30
79
17
26
12
16
θCA
www.fairchildsemi.com
is determined
°C/W