IDTTSE2002B3CNCG8 IDT, Integrated Device Technology Inc, IDTTSE2002B3CNCG8 Datasheet - Page 29

• Manufacturer Part Number: IDTTSE2002B3CNCG8
• Description: IC TEMP SENS EEPROM TDFN-8
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDTTSE2002B3CNCG8

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Control Logic, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -20°C ~ 125°C
• Output Type: 2-Wire Serial, I²C™/SMBUS™
• Output Alarm: No
• Output Fan: No
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -20°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WFDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-2034-2

Use in a Memory Module
Address inputs (SA0, SA1, SA2) must be connected to V
DIMM socket (as shown in the Unique Addressing table). The pull-up resistors needed for normal behavior of the I
bus of the mother-board
Unique Addressing of SPDs in DIMM Applications
EVENT should be programmed for the active low mode. Also note that comparator mode or TCRIT-only mode for EVENT on a wire-OR bus will show
the combined results of all devices wired to the EVENT signal.
Programming the TSE2002B3C
DIMM Isolated
write-protection using the SWP and CWP instructions. To issue the SWP and CWP instructions, the DIMM must be inserted in the application-specific
slot where the SA0 signal can be driven to VHV during the whole instruction. This programming step is mainly intended for use by DIMM makers,
whose end application manufacturers will want to clear this write-protection with the CWP on their own specific programming equipment, to modify the
lower 128 Bytes, and finally to set permanently the write-protection with the PSWP instruction.
DIMM Inserted in the Application Mother Board
to the Acknowledge When Writing Data or Defining Write Protection table on how the Ack bits can be used to identify the write-protection status.
•
•
In the Dual Inline Memory Module (DIMM) application, the TSE2002B3C is soldered directly onto the printed circuit module. The three Select
The Event pin is expected to be used in a wire-OR configuration with a pull-up resistor to VDDSPD on the motherboard. In this configuration,
The situations in which the TSE2002B3C is programmed can be considered under two headings:
With specific programming equipment, it is possible to define the TSE2002B3C content, using Byte and Page Write instructions, and its
As the final application cannot drive the SA0 pin to V
When the DIMM is isolated (not inserted on the PCB motherboard)
When the DIMM is inserted on the PCB motherboard
Note: 0 = V
DIMM Position
0
1
2
3
4
5
6
7
SSSPD
, 1 = V
DDSPD
SA2
0
0
0
0
1
1
1
1
.
SA1
HV
0
0
1
1
0
0
1
1
SSSPD
, the only possible action is to freeze the write-protection with the PSWP instruction. Refer
or V
29 of 30
DDSPD
SA0
0
1
0
1
0
1
0
1
directly (that is without using a pull-up or pull-down resistor) through the
2
C bus are connected on the I
May 12, 2010
2
C