PIC18F2410-E/ML Microchip Technology, PIC18F2410-E/ML Datasheet - Page 360

• Manufacturer Part Number: PIC18F2410-E/ML
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,28PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2410-E/ML

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core: PIC
• Processor Series: PIC18F
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 40 MHz
• Data Ram Size: 768 B
• On-chip Adc: 10 bit
• Number Of Programmable I/os: 25
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Mounting Style: SMD/SMT
• Height: 0.88 mm
• Interface Type: EUSART, I2C, MSSP, SPI
• Length: 6 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 6 mm
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18F2X1X/4X1X
APPENDIX C:
This appendix discusses the considerations for
converting from previous versions of a device to the
ones listed in this data sheet. Typically, these changes
are due to the differences in the process technology
used. An example of this type of conversion is from a
PIC16C74A to a PIC16C74B.
DS39636D-page 362
Not Applicable
CONVERSION
CONSIDERATIONS
APPENDIX D:
This section discusses how to migrate from a Baseline
device (i.e., PIC16C5X) to an Enhanced MCU device
(i.e., PIC18FXXX).
The following are the list of modifications over the
PIC16C5X microcontroller family:
Not Currently Available
MIGRATION FROM
BASELINE TO
ENHANCED DEVICES
© 2009 Microchip Technology Inc.