T709N26TOF Infineon Technologies, T709N26TOF Datasheet - Page 3

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T709N26TOF

Manufacturer Part Number
T709N26TOF
Description
SCR Modules 2.6KV 14.5KA
Manufacturer
Infineon Technologies
Datasheet

Specifications of T709N26TOF

Rated Repetitive Off-state Voltage Vdrm
2600 V
Off-state Leakage Current @ Vdrm Idrm
100 mA
Holding Current (ih Max)
600 mA
Mounting Style
Press Fit
Package / Case
T-7526
Breakover Current Ibo Max
14500 A
Gate Trigger Current (igt)
300 mA
Gate Trigger Voltage (vgt)
1.5 V
Repetitive Peak Forward Blocking Voltage
2600 V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
T709N26TOF
Manufacturer:
HITACH
Quantity:
1 000
Part Number:
T709N26TOF
Quantity:
63
i
[A]
t
P
[W]
T
c
TAV
2400
2000
1600
1200
[°C]
120
100
800
400
80
60
40
20
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
T 709 N / 1
Bild / Fig. 1
Durchlaßkennlinien / On-state characteristics i
a -Typische Kennlinien / typical characteristics
b -Grenzkennlinien / limiting characteristics
T 709 N / 3
Bild / Fig. 3
Höchstzulässige Gehäusetemperatur / Max. allowable case temperature
t
Parameter: Stromflußwinkel / Current conduction angle
T 709 N / 5
Bild / Fig. 5
Durchlaßverlustleistung / On-state power loss P
Parameter: Stromflußwinkel / Current conduction angle
A
= f(I
0
TAVM
200
1
)
Anodenseitige Kühlung / Anode-sided cooling
Beidseitige Kühlung / Two-sided cooling
200
a
400
2
= 30°
b
= 30°
t
600
vj
3
60°
400
= 25°C
90°
800
4
60°
120°
600
1000
T
5
= f(v
TAV
180°
90°
= f(I
T
), t
1200
I
TAV
TAVM
vj
6
120°
v
I
T
= t
TAV
)
800
t
vj
[V]
vj max
= 125°C
[A]
[A]
0
1400
180°
7
DC
1000
1600
8
P
[W]
t
t
A
C
TAV
2400
2000
1200
[°C]
[°C]
800
400
120
100
120
100
80
60
40
20
80
60
40
20
0
0
0
0
T 709 N / 2
Bild / Fig. 2
Durchlaßverlustleistung / On-state power loss P
Parameter: Stromflußwinkel / Current conduction angle
T 709 N / 4
Bild / Fig. 4
Höchstzulässige Kühlmitteltemperatur / Max. allowable cooling medium
temperature t
Kühlkörper / Heatsink: K0.05F
Parameter: Stromflußwinkel / Current conduction angle
T 709 N / 6
Bild / Fig. 6
Höchstzulässige Gehäusetemperatur / Max. allowable case temperature
t
Parameter: Stromflußwinkel / Current conduction angle
A
= f(I
0
100
TAVM
= 30° 60°
200
)
Luftsebstkühlung / Natural air-cooling
Verstärkte Luftkühlung / Forced air-cooling, V
Anodenseitige Kühlung / Anode-sided cooling
Beidseitige Kühlung / Two-sided cooling
200
90°
A
120°
= f(I
= 30°
180°
400
200
TAVM
300
)
60°
600
30°
= 30°
400
90°
120°
800
500
400
60°
60°
90°
600
1000
180°
TAV
120°
90°
700
= f(I
1200
I
DC
TAV
600
I
180°
TAVM
TAVM
L
I
TAV
)
= 120 l/s
800
120°
[A]
T 709 N
[A]
[A]
0
0
1400
900
DC
180°
1000
1600
800

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