SIDC11D60SIC3 Infineon Technologies, SIDC11D60SIC3 Datasheet
SIDC11D60SIC3
Specifications of SIDC11D60SIC3
Related parts for SIDC11D60SIC3
SIDC11D60SIC3 Summary of contents
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... Die Size 1.15 x 0.97 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC11D60SIC3 A C Package Ordering Code Q67050-A4161- sawn on foil A104 1.15 x 0.97 0.85 x 0.67 1 ...
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... Static Electrical Characteristics Parameter Symbol Reverse leakage current I R Forward voltage drop V F Dynamic Electrical Characteristics Parameter Symbol Total capacitive charge Q C Switching time Total capacitance C Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC11D60SIC3 Symbol Condition RSM = =10 ms sinusoidal 100 FRM ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC11D60SIC3 1150 850 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC11D60SIC3 INFINEON TECHNOLOGIES SDP04S60 ...