SIDC14D60F6 Infineon Technologies, SIDC14D60F6 Datasheet
SIDC14D60F6
Specifications of SIDC14D60F6
Related parts for SIDC14D60F6
SIDC14D60F6 Summary of contents
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... Die Size F 2 45A 3.8 x 3.8 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC14D60F6 A C Package Ordering Code Q67050-A4165- sawn on foil A001 3.8 x 3.8 14 ...
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... ° =400V R I =45A ° di/dt=1000A ° =45A di/dt=1000A =45A / di/dt=1000A =45A di/dt=1000A SIDC14D60F6 Value Unit 600 tbd 90 -55...+150 C Value Unit min. Typ. max. 27 µA 600 V 1.45 V Value Unit min. Typ. max. 140 ns 195 1400 n C 2900 3.1 1 4.4 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 4174M, Edition 2, 14.05.2003 Preliminary SIDC14D60F6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4174M, Edition 2, 14.05.2003 Preliminary SIDC14D60F6 INFINEON TECHNOLOGIES / EUPEC tbd ...