NDC7003P Fairchild Semiconductor, NDC7003P Datasheet

NDC7003P

Manufacturer Part Number

NDC7003P

Description

MOSFET 2P-CH 60V 340MA SSOT6

Manufacturer

Fairchild Semiconductor

Series

PowerTrench®r

Type

Power MOSFETr

Datasheet

1.NDC7003P.pdf (5 pages)

Specifications of NDC7003P

Fet Type

2 P-Channel (Dual)

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

5 Ohm @ 340mA, 10V

Drain To Source Voltage (vdss)

60V

Current - Continuous Drain (id) @ 25° C

340mA

Vgs(th) (max) @ Id

3.5V @ 250µA

Gate Charge (qg) @ Vgs

2.2nC @ 10V

Input Capacitance (ciss) @ Vds

66pF @ 25V

Power - Max

700mW

Mounting Type

Surface Mount

Package / Case

6-SSOT, SuperSOT-6

Configuration

Dual

Transistor Polarity

P-Channel

Resistance Drain-source Rds (on)

5 Ohm @ 10 V

Drain-source Breakdown Voltage

60 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

0.34 A

Power Dissipation

960 mW

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Number Of Elements

Polarity

Channel Mode

Enhancement

Drain-source On-res

5Ohm

Drain-source On-volt

60V

Gate-source Voltage (max)

±20V

Operating Temp Range

-55C to 150C

Operating Temperature Classification

Military

Mounting

Surface Mount

Pin Count

Package Type

SuperSOT

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

NDC7003PTR

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Mendoza, Joseph

E-mail: Joseph.Mendoza@notes.fairchildsemi.com

Phone: 63-32-400534

Implementation of change:

Expected 1st Device Shipment Date: 2007/11/24

Earliest Year/Work Week of Changed Product: D0744

Change Type Description: Die Attach Method

Description of Change (From): TiNiAg Backmetal and eutectic die attach process

Description of Change (To): TiNiAg backmetal and skip cure adhesive die attach process

Reason for Change : Process and Device improvement

Qual/REL Plan Numbers : Q20070126

Qualification :

Adhesive Die Attach and TiNiAg backmetal Qualification builds for SSOT-6L pass

assembly level and reliability stress test requirements. Adhesive Die Attach process

and TiNiAg backmetal is recommended for use on SSOT-6L package.

Results/Discussion

Test: (Autoclave)

Lot

Q20070126AAACLV

Q20070126ABACLV

Q20070126ACACLV

Test: (Power Cycle)

Lot

Q20070126AAPRCL

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Device

FDC6401N

Technical Contact:

Name: Mendoza, Joseph

E-mail: Joseph.Mendoza@notes.fairchildsemi.com

Phone: 63-32-400534

Device

FDC6401N

5000-CYCLES

0/77

96-HOURS

0/77

10000-CYCLES 15000-CYCLES Failure Code

0/77

Date Issued On : 2007/05/11

Date Created : 2007/03/30

Failure Code

PCN# : Q1071307

Pg. 1

Related parts for NDC7003P

NDC7003P Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

... Q20070126ACPCNL1A FDC6401N Product Id Description : Affected FSIDs : FDC608PZ FDC6302P FDC6303N_NL FDC6320C_NL FDC634P FDC634P_NL FDC638P FDC638P_NF073 FDC640P FDC640P_NF073 FDC642P_F073 FDC642P_NL FDC654P_NBGT006 FDC654P_NL FDC655BN_NBNN007 NDC7003P 0/77 0/77 0/77 0/77 100-CYCLES 500-CYCLES 0/77 0/77 0/77 0/77 0/77 0/77 96-HOURS 0/77 0/77 0/77 Results 0/308 0/308 ...

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