FDMC2610 Fairchild Semiconductor, FDMC2610 Datasheet

FDMC2610

Manufacturer Part Number

FDMC2610

Description

MOSFET N-CH 200V 2.2A POWER33-8

Manufacturer

Fairchild Semiconductor

Series

UniFET™r

Datasheet

1.FDMC2610.pdf (7 pages)

Specifications of FDMC2610

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

200 mOhm @ 2.2A, 10V

Drain To Source Voltage (vdss)

200V

Current - Continuous Drain (id) @ 25° C

2.2A

Vgs(th) (max) @ Id

4V @ 250µA

Gate Charge (qg) @ Vgs

18nC @ 10V

Input Capacitance (ciss) @ Vds

960pF @ 100V

Power - Max

2.1W

Mounting Type

Surface Mount

Package / Case

8-MLP, Power33

Configuration

Single Quad Drain Triple Source

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

0.2 Ohms

Forward Transconductance Gfs (max / Min)

7 S

Drain-source Breakdown Voltage

200 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

9.5 A

Power Dissipation

42 W

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMC2610TR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

FDMC2610

Manufacturer:

FAIRCHILD/ON

Quantity:

20 000

Company:

H&T Electronics

Part Number:

FDMC2610

Quantity:

3 000

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Lam, HH

E-mail: HH.Lam@fairchildsemi.com

Phone: 604 850 2392

Implementation of change:

Expected 1st Device Shipment Date: 2008/03/20

Earliest Year/Work Week of Changed Product: 0813

Change Type Description: Mold Compound

Description of Change (From): 8L MLP3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1.

Description of Change (To): 8L MLP 3x3 package assembly at all FSC approved manufacturing

location(s) (Carsem) using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070296

Qualification :

All the reliability tests defined in this qual plan completed with no failures. Therefore

Carsem is qualified to assemble MLP 3x3 8L package.

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Po, Peter

E-mail: peter.po@fairchildsemi.com

Phone: 604 850 2744

Date Issued On : 2008/03/17

Date Created : 2008/01/25

PCN# : Q4074601-A

Pg. 1

Related parts for FDMC2610

FDMC2610 Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change From Change To Results/Discussion Test: (Autoclave) Lot Device Q20070296BAACLV FDMC2674 Q20070296CAACLV FDMC8854 Test: (High Temperature Gate Bias) Lot Device Q20070296BAHTGB FDMC2674 Q20070296BAHTGB FDMC2674 Q20070296CAHTGB FDMC8854 Q20070296CAHTGB FDMC8854 Test: (High Temperature Reverse Bias) Lot Device Q20070296BAHTRB FDMC2674 Q20070296BAHTRB FDMC2674 Q20070296CAHTRB ...

Page 3

... For a complete listing of products covered in this PCN release, please refer to the affected FSID listing. Affected FSIDs : FDM3300NZ FDM3622_NL FDMC2523P FDMC3300NZA FDMC8854 0/77 0/77 0/77 0/77 0/77 0/77 264-HOURS 0/77 0/77 0/77 Results 0/154 0/231 0/231 FDM3300NZ_NL FDM6296 FDMC2610 FDMC5614P FDMC8878 Failure Code Failure Code FDM3622 FDM6296_NL FDMC2674 FDMC8554 FDMC8878_NBSE003 Pg. 3 ...

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