ISPGDX160A-5Q208 Lattice, ISPGDX160A-5Q208 Datasheet - Page 3

• Manufacturer Part Number: ISPGDX160A-5Q208
• Description: Analog & Digital Crosspoint ICs PROGRAMMABLE GEN DIG CROSSPOINT
• Manufacturer: Lattice

Specifications of ISPGDX160A-5Q208

• Mounting Style: Through Hole
• Number Of Arrays: 1
• Operating Supply Voltage: 5 V
• Supply Type: Single
• Configuration: 160 x 160
• Package / Case: DIP-24
• Input Level: TTL
• Output Level: TTL
• Supply Voltage (max): 5.25 V
• Supply Voltage (min): 4.75 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Product: Digital Crosspoint
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

found in each I/O cell. Each output has individual, pro-
grammable I/O tri-state control (OE), output latch clock
(CLK), clock enable (CLKEN), and two multiplexer con-
trol (MUX0 and MUX1) inputs. Polarity for these signals
is programmable for each I/O cell. The MUX0 and MUX1
inputs control a fast 4:1 MUX, allowing dynamic selection
of up to four signal sources for a given output. A wider
16:1 MUX can be implemented with the MUX expander
feature of each I/O and a propagation delay increase of
2.0ns. OE, CLK, CLKEN, and MUX0 and MUX1 inputs
can be driven directly from selected sets of I/O pins.
Optional dedicated clock input pins give minimum clock-
to-output delays. CLK and CLKEN share the same set of
I/O pins. CLKEN disables the register clock when
CLKEN = 0.
Through in-system programming, connections between
I/O pins and architectural features (latched or registered
inputs or outputs, output enable control, etc.) can be
defined. In keeping with its data path application focus,
the ispGDXV devices contain no programmable logic
arrays. All input pins include Schmitt trigger buffers for
noise immunity. These connections are programmed
into the device using non-volatile E
Non-volatile technology means the device configuration
is saved even when the power is removed from the
device.
Table 1. ispGDXV Family Members
Description (Continued)
* The CLK/CLK_EN, OE, MUX0 and MUX1 terminals on each I/O cell can each be assigned to
** Global clock pins Y0, Y1, Y2 and Y3 are multiplexed with CLKEN0, CLKEN1, CLKEN2 and
I/O Pins
I/O-OE Inputs*
I/O-CLK / CLKEN Inputs*
I/O-MUXsel1 Inputs*
I/O-MUXsel2 Inputs*
Dedicated Clock Pins**
BSCAN Interface
RESET
Pin Count/Package
EPEN
TOE
25% of the I/Os.
CLKEN3 respectively in all devices.
2
CMOS technology.
100-Pin TQFP
ispGDX80VA
80
20
20
20
20
2
1
1
4
1
Specifications ispGDX160V/VA
2
In addition, there are no pin-to-pin routing constraints for
1:1 or 1:n signal routing. That is, any I/O pin configured
as an input can drive one or more I/O pins configured as
outputs.
The device pins also have the ability to set outputs to
fixed HIGH or LOW logic levels (Jumper or DIP Switch
mode). Device outputs are specified for 24mA sink and
12mA source current (at JEDEC LVTTL levels) and can
be tied together in parallel for greater drive. On the
ispGDXVA, each I/O pin is individually programmable for
3.3V or 2.5V output levels as described later. Program-
mable output slew rate control can be defined
independently for each I/O pin to reduce overall ground
bounce and switching noise.
All I/O pins are equipped with IEEE1149.1-compliant
Boundary Scan Test circuitry for enhanced testability. In
addition, in-system programming is supported through
the Test Access Port via a special set of private com-
mands.
The ispGDXV I/Os are designed to withstand “live inser-
tion” system environments. The I/O buffers are disabled
during power-up and power-down cycles. When design-
ing for “live insertion,” absolute maximum rating conditions
for the Vcc and I/O pins must still be met.
ispGDXVA Device
208-Ball fpBGA
ispGDX160VA
208-Pin PQFP
272-Ball BGA
160
40
40
40
40
4
1
1
4
1
388-Ball fpBGA
ispGDX240VA
240
60
60
60
60
4
1
1
4
1