IPD22N08S2L-50 Infineon Technologies, IPD22N08S2L-50 Datasheet

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IPD22N08S2L-50

Manufacturer Part Number
IPD22N08S2L-50
Description
MOSFET N-CH 75V 27A TO252-3
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPD22N08S2L-50

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
50 mOhm @ 50A, 10V
Drain To Source Voltage (vdss)
75V
Current - Continuous Drain (id) @ 25° C
27A
Vgs(th) (max) @ Id
2V @ 31µA
Gate Charge (qg) @ Vgs
33nC @ 10V
Input Capacitance (ciss) @ Vds
630pF @ 25V
Power - Max
75W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
50 m Ohms
Drain-source Breakdown Voltage
75 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
22 A
Power Dissipation
75 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SP000252163

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IPD22N08S2L-50
Manufacturer:
INFINEON
Quantity:
12 500
Company:
Part Number:
IPD22N08S2L-50
Quantity:
75
Rev. 1.0
OptiMOS
Features
• N-channel Logic Level - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Ultra low Rds(on)
• 100% Avalanche tested
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Type
IPD22N08S2L-50
Green package (lead free)
®
Power-Transistor
1)
Package
PG-TO252-3-11
j
=25 °C, unless otherwise specified
Symbol
I
I
E
V
P
T
D
D,pulse
j
AS
GS
tot
, T
Marking
2N08L50
stg
T
T
V
T
I
T
D
C
C
C
C
GS
=22A
page 1
=25 °C, V
=100 °C,
=25 °C
=25 °C
=10 V
Conditions
1)
GS
Product Summary
V
R
I
D
=10 V
DS
DS(on),max
-55 ... +175
55/175/56
Value
108
±20
27
19
94
75
PG-TO252-3-11
IPD22N08S2L-50
75
50
25
2006-07-18
Unit
A
mJ
V
W
°C
V
m
A

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IPD22N08S2L-50 Summary of contents

Page 1

... Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev. 1.0 Product Summary DS(on),max I D Marking 2N08L50 Symbol Conditions I T =25 ° =100 ° = =25 °C D,pulse =22A =25 °C tot stg page 1 IPD22N08S2L- PG-TO252-3-11 Value Unit 108 94 mJ ± -55 ... +175 °C 55/175/56 2006-07-18 ...

Page 2

... (BR)DSS =31 µA GS(th = DSS T =25 ° = =125 ° = GSS =50 A DS(on = =50 A, DS(on page 2 IPD22N08S2L-50 Values min. typ. max 100 - - 1.2 1 100 = 100 - 58 38.5 50.0 Unit 2 K µ mΩ 2006-07-18 ...

Page 3

... Device 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 Symbol Conditions C iss oss f =1 MHz C rss t d( d(off = = plateau =25 ° S,pulse = =25 ° = /dt =100 A/µ = /dt =100 A/µs F page 3 IPD22N08S2L-50 Values min. typ. max. - 630 = 160 - = 3 0 Unit - 2 100 1 2006-07-18 ...

Page 4

... parameter 1000 100 Rev. 1.0 2 Drain current 150 200 0 4 Max. transient thermal impedance Z = f(t thJC parameter µs 10 µ 100 µ 100 [V] page 4 IPD22N08S2L- ≥ 100 150 T [° 0.5 0.1 0.05 0.01 single pulse - [s] p 200 - 2006-07-18 ...

Page 5

... DS j parameter 100 Typ. transfer characteristics parameter °C 175 ° [V] GS Rev. 1.0 6 Typ. drain-source on-state resistance DS(on) parameter: V 170 150 130 5 V 110 [V] 8 Typ. Forward transconductance parameter -55 ° page 5 IPD22N08S2L- ° 3 [ 25° [ 2006-07-18 ...

Page 6

... Typ. gate threshold voltage V = f(T GS(th) parameter: I 2.5 2 1.5 1 0.5 0 100 140 180 12 Typical forward diode characteristicis IF = f(V SD parameter Ciss Coss 1 10 Crss [V] page 6 IPD22N08S2L- 155 µA 31 µA -60 - 100 T [° °C 175 °C 0 0.2 0.4 0.6 0 [V] SD 140 180 1.2 1.4 1 ...

Page 7

... I D 400 5.5 A 350 300 250 200 11 A 150 100 [° Typ. drain-source breakdown voltage BR(DSS -60 - [°C] j Rev. 1.0 14 Typ. gate charge V = f(Q GS gate 125 175 0 16 Gate charge waveforms 100 140 180 page 7 IPD22N08S2L- pulsed [nC] gate gate gate 2006-07-18 30 ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 IPD22N08S2L-50 2006-07-18 ...

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