IPD90N04S3-H4 Infineon Technologies, IPD90N04S3-H4 Datasheet
IPD90N04S3-H4
Specifications of IPD90N04S3-H4
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IPD90N04S3-H4 Summary of contents
Page 1
... Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev. 1.0 Product Summary Marking QN04H4 Symbol Conditions I T =25 ° =100 ° = =25 °C D,pulse = =25 °C tot stg - - page 1 IPD90N04S3-H4 DS DS(on),max D PG-TO252-3-11 Value = 360 330 90 ±20 115 -55 ... +175 55/175/ 4 Unit °C 2008-08-01 ...
Page 2
... Rev. 1.0 Symbol Conditions R - thJC R minimal footprint thJA cooling area =25 °C, unless otherwise specified (BR)DSS =65 µA GS(th = DSS T =25 ° = =125 ° = GSS = =90 A DS(on page 2 IPD90N04S3-H4 Values min. typ. max 1 2.1 3.0 4 100 = 100 - 3.4 4.3 Unit K µA nA mΩ 2008-08-01 ...
Page 3
... d(off = = plateau =25 ° S,pulse = =25 ° = /dt =100 A/µ 1.3K/W the chip is able to carry 122A at 25°C. thJC 2 (one layer, 70 µm thick) copper area for drain page 3 IPD90N04S3-H4 Values min. typ. max. - 3000 3900 = 850 1100 - 130 - = 5 0. Unit pF 200 - 360 1.3 ...
Page 4
... parameter 1000 100 Rev. 1.0 2 Drain current I = f(T D 100 150 200 4 Max. transient thermal impedance Z = f(t thJC parameter µs 10 µ 100 µ 100 [V] page 4 IPD90N04S3- ≥ 100 T [° 0.5 0.1 0.05 0.01 single pulse - [s] p 150 200 - 2008-08-01 ...
Page 5
... T j 360 320 280 240 200 160 120 Rev. 1.0 6 Typ. drain-source on-state resistance R = f(I DS(on) parameter 6 5 [V] 8 Typ. drain-source on-state resistance R = f(T DS(on) 7 -55 °C 25 °C 6 175 ° -60 [V] page 5 IPD90N04S3- ° 100 T [° 6 100 120 140 180 2008-08-01 ...
Page 6
... V SD Rev. 1.0 10 Typ. capacitances 650µ 100 140 180 12 Typ. avalanche characteristics parameter: T 100 10 25 °C 1 0.8 1 1.2 1.4 [V] page 6 IPD90N04S3- MHz [ j(start) 100 °C 150 ° 100 t [µs] AV Ciss Coss Crss °C 1000 2008-08-01 ...
Page 7
... A 500 400 300 45 A 200 90 A 100 [° Typ. gate charge pulsed GS gate D parameter gate Rev. 1.0 14 Typ. drain-source breakdown voltage V BR(DSS 125 175 16 Gate charge waveforms s(th (th [nC] page 7 IPD90N04S3- -60 - 100 T [° 140 180 Q gate 2008-08-01 ...
Page 8
... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 IPD90N04S3-H4 2008-08-01 ...
Page 9
... Revision History Version Rev. 1.0 Date page 9 IPD90N04S3-H4 Changes 2008-08-01 ...