BSP299 L6327 Infineon Technologies, BSP299 L6327 Datasheet

MOSFET N-CH 500V 400MA SOT-223

BSP299 L6327

Manufacturer Part Number
BSP299 L6327
Description
MOSFET N-CH 500V 400MA SOT-223
Manufacturer
Infineon Technologies
Series
SIPMOS®r
Datasheet

Specifications of BSP299 L6327

Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
4 Ohm @ 400mA, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
400mA
Vgs(th) (max) @ Id
4V @ 1mA
Input Capacitance (ciss) @ Vds
400pF @ 25V
Power - Max
1.8W
Mounting Type
Surface Mount
Minimum Operating Temperature
- 55 C
Configuration
Single Dual Drain
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
4 Ohm @ 10 V
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.4 A
Power Dissipation
1800 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
BSP299L6327XT
SP000089200
SIPMOS
• N channel
• Enhancement mode
• Avalanche rated
• V
• Pb-free lead plating; RoHS compliant
Rev 2.1
Type
BSP 299
Type
BSP 299
Maximum Ratings
Parameter
Continuous drain current
T
DC drain current, pulsed
T
Avalanche energy, single pulse
I
T
Gate source voltage
Power dissipation
T
D
A
A
A
j
GS(th)
= 1.2 A, R
= 25 °C
= 25 °C
= 25 °C
= 25 °C
= 2.1 ... 4.0 V
®
Small-Signal Transistor
GS
= 25
V
500 V
Pb-free
Yes
DS
I
0.4 A
D
R
4
Tape and Reel Information
L6327
DS(on)
1
Symbol
I
I
E
V
P
D
Dpuls
AS
GS
tot
Package
SOT-223
Pin 1
G
Values
±
Pin 2
130
Marking
BSP299
0.4
1.6
1.8
D
20
Pin 3
S
2009-03-25
BSP 299
Unit
A
mJ
V
W
Pin 4
D

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BSP299 L6327 Summary of contents

Page 1

SIPMOS Small-Signal Transistor • N channel • Enhancement mode • Avalanche rated • 2.1 ... 4.0 V GS(th) • Pb-free lead plating; RoHS compliant V Type DS BSP 299 500 V Type Pb-free BSP 299 Yes Maximum ...

Page 2

Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air Therminal resistance, junction-soldering point DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 1) Transistor on epoxy pcb ...

Page 3

Electrical Characteristics Parameter Dynamic Characteristics Transconductance ≥ 0 DS(on)max, D Input capacitance = MHz ...

Page 4

Electrical Characteristics Parameter Reverse Diode Inverse diode continuous forward current = 25 ° Inverse diode direct current,pulsed °C A Inverse diode forward voltage = 0 ...

Page 5

Power dissipation = ƒ tot A 2.0 W 1.6 P tot 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Safe operating area I =f parameter : ...

Page 6

Typ. output characteristics = ƒ parameter ° 0.9 0.9 0 tot d 10V l c ...

Page 7

Drain-source on-resistance = ƒ (on) j parameter 0 Ω ( typ ...

Page 8

Avalanche energy E AS parameter 1 Ω 163 140 mJ 120 E 110 AS 100 ...

Page 9

Package outlines SOT-223 Dimensions in mm Rev 2.1 9 BSP 299 2009-03-25 ...

Page 10

... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system ...

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