IPP80N06S2-09 Infineon Technologies, IPP80N06S2-09 Datasheet - Page 3

MOSFET N-CH 55V 80A TO220-3

IPP80N06S2-09

Manufacturer Part Number
IPP80N06S2-09
Description
MOSFET N-CH 55V 80A TO220-3
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of IPP80N06S2-09

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
9.1 mOhm @ 50A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
80A
Vgs(th) (max) @ Id
4V @ 125µA
Gate Charge (qg) @ Vgs
80nC @ 10V
Input Capacitance (ciss) @ Vds
2360pF @ 25V
Power - Max
190W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
9.1 m Ohms
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
80 A
Power Dissipation
190 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Fall Time
28 ns
Minimum Operating Temperature
- 55 C
Rise Time
29 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SP000218740

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IPP80N06S2-09
Manufacturer:
INF
Quantity:
300
Part Number:
IPP80N06S2-09
Manufacturer:
INFINEON
Quantity:
12 000
Part Number:
IPP80N06S2-09
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Company:
Part Number:
IPP80N06S2-09
Quantity:
4 800
Rev. 1.0
1)
information see Application Note ANPS071E at www.infineon.com/optimos
2)
3)
4)
5)
connection. PCB is vertical in still air.
Parameter
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
Gate charge total
Gate plateau voltage
Reverse Diode
Diode continous forward current
Diode pulse current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Current is limited by bondwire; with an R
Defined by design. Not subject to production test.
See diagram 13.
Qualified at -20V and +20V.
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2)
2)
2)
2)
2)
2)
Symbol
C
C
C
t
t
t
t
Q
Q
Q
V
I
I
V
t
Q
thJC
d(on)
r
d(off)
f
S
S,pulse
rr
rss
plateau
SD
iss
oss
gs
gd
g
rr
= 0.8 K/W the chip is able to carry 99 A at 25°C. For detailed
V
f =1 MHz
V
I
V
V
T
V
T
V
di
D
C
j
GS
DD
DD
GS
GS
R
=80 A, R
=25 °C
F
page 3
=25 °C
=30 V, I
/dt =100 A/µs
=0 V, V
=30 V, V
=44 V, I
=0 to 10 V
=0 V, I
Conditions
F
F
G
2
DS
=80 A,
=I
D
=4.7
(one layer, 70 µm thick) copper area for drain
GS
=80 A,
=25 V,
S
=10 V,
,
min.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Values
2360
typ.
610
150
5.5
0.9
14
29
39
28
12
24
60
50
76
-
-
IPB80N06S2-09
IPP80N06S2-09
max.
320
1.3
16
37
80
80
63
95
-
-
-
-
-
-
-
-
2006-03-13
Unit
pF
ns
nC
V
A
V
ns
nC

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