TSEV81102G0TPZR3 E2V, TSEV81102G0TPZR3 Datasheet - Page 30

• Manufacturer Part Number: TSEV81102G0TPZR3
• Manufacturer: E2V

Specifications of TSEV81102G0TPZR3

• Lead Free Status / RoHS Status: Not Compliant

6.4.5
6.5
Figure 6-5.
30
Detailled Cross Section
TS81102G0
Moisture Characteristic
Die Attach Epoxy/Ag
TBGA 240: 1/2 Cross Section
Block Epoxy resin
encapsulant
Silicon Die
This device is sensitive to moisture (MSL3 according to the JEDEC standard).
The shelf life in a sealed bag is 12 months at < 40°C and < 90% relative humidity (RH).
After this bag is opened, devices that might be subjected to infrared reflow, vapor-phase reflow,
or equivalent processing (peak package body temperature 220°C) must be:
The devices require baking before mounting, if the humidity indicator is > 20% when read at
23°C ±5°C.
If baking is required, the devices may be baked for:
The following diagram depicts a detailed cross section of the DMUX TBGA package.
In the DMUX package shown above, the die’s rear side is attached to the copper heat spreader,
so the copper heat spreader is at -5V.
It is necessary to use a heat sink tied to the copper heat speader.
Moreover, there is only a little layer of painting over the copper heat spreader which does not
isolate it.
It is therefore recommended to either isolate the heat sink from the other components of the
board or to electrically isolate the copper heat spreader from the heat sink. In the latter case,
one should use adequate low Rth electrical isolation.
• mounted within 168 hours at factory conditions of ≤ 30°C/60% RH, or
• stored at ≤ 20% RH.
• 192 hours at 40°C + 5°C/-0°C and < 5% RH for low temperature device containers, or
• 24 hours at 125°C ± 5°C for high-temperature device containers.
Gold
wires
Copper Heatspreader
Copper traces
and
Solder Balls Pads
on metal 1 side
Block overcoat
Sn/Pb/Ag
62/36/2 Eutectic
Solder Balls
Adhesive
Solder Mask
Metal 1 side
Solder Mask
Metal 2 side
Polyimide Tape
2105D–BDC–07/05