PIC16F726-E/SO Microchip Technology, PIC16F726-E/SO Datasheet - Page 301

• Manufacturer Part Number: PIC16F726-E/SO
• Description: 14KB Flash Program, 1.8V-5.5V, 16MHz Internal Oscillator, 8b ADC, CCP, I2C/SPI,
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F726-E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 11 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F722, PIC16LF722, PIC16F722T, PIC16LF722T
PIC16F723, PIC16LF723, PIC16F723T, PIC16LF723T
PIC16F724, PIC16LF724, PIC16F724T, PIC16LF724T
PIC16F726, PIC16LF726, PIC16F726T, PIC16LF726T
PIC16F727, PIC16LF727, PIC16F727T, PIC16LF727T
I
E
MV
ML
P
PT
SO
SP
SS
3-Digit Pattern Code for QTP (blank otherwise)
Range
X
= -40°C to +85°C
= -40°C to +125°C
= Micro Lead Frame (UQFN)
=
=
=
=
=
=
Micro Lead Frame (QFN)
Plastic DIP
TQFP (Thin Quad Flatpack)
SOIC
Skinny Plastic DIP
SSOP
Package
/XX
Pattern
XXX
PIC16F72X/PIC16LF72X
(1)
(1)
(1)
(1)
(1)
Examples:
a)
b)
Note 1:
PIC16F722-E/SP 301 = Extended Temp.,
skinny PDIP package, QTP pattern #301
PIC16F722-I/SO = Industrial Temp., SOIC
package
T
= In tape and reel.
.
DS41341E-page 301