MT45W4MW16PCGA-70 IT Micron Technology Inc, MT45W4MW16PCGA-70 IT Datasheet - Page 23

• Manufacturer Part Number: MT45W4MW16PCGA-70 IT
• Manufacturer: Micron Technology Inc

Specifications of MT45W4MW16PCGA-70 IT

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Package Dimensions
Figure 24:
PDF: 09005aef81f0698d / Source: 09005aef81f06935
64mb_asyncpage_cr1_0_p25z.fm - Rev. D 7/09 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners. CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SEATING
PLANE
for production devices. Although considered final, these specifications are subject to change, as further product
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
PRE-REFLOW BALL
DIAMETER IS 0.35
ON A 0.30 SMD
BALL PAD.
0.10 A
5.25
48X Ø0.37
BALL A6
48-Ball VFBGA
2.625
0.70 ±0.05
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W4MW16PCGA uses “green” packaging.
0.25mm per side.
1.875
development and data characterization sometimes occur.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
Technologies outside the U.S.
0.75 TYP
C L
4.00 ±0.05
64Mb: 4 Meg x 16 Async/Page CellularRAM 1.0
BALL A1
BALL A1 ID
23
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
BALL A1 ID