SRF 55V02S NB Infineon Technologies, SRF 55V02S NB Datasheet - Page 4

• Manufacturer Part Number: SRF 55V02S NB
• Manufacturer: Infineon Technologies

Specifications of SRF 55V02S NB

• Operating Temperature (max): 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Development Tool
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Table 1:
For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local
Infineon sales office.
Pin Description
Figure 1: Pin Configuration Module Contactless Card – MFCC1 (top / bottom view)
Figure 2: Pin Configuration Module Contactless Card – MCC2 (top view)
1)
2)
Short Product Information
Type
SRF 55V02S C
SRF 55V02S NB
SRF 55V02S MFCC1 S-MFCC1-2-1
SRF 55V02S MCC2
Available as a Module Flip Chip Contactless (MFCC1), Module Contactless Card (MCC) for embedding in plastic
cards, as NiAu-bump version (NB) or as a die on sawn / unsawn wafer for customer packaging
FCoS™ Flip Chip on Substrate
my-d
®
Ordering and Packaging information
Evaluation Kit including my-d
Ordering Information
Package
Sawn wafer
NiAu bump wafer
P-MCC2-2-1
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®
2)
Manager Software
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256 bytes
User
Memory
64 bytes
Admin.
my-d
Pages
32
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vicinity secure
Ordering Code
SP000009364
SP000009491
SP000010034
SP000009368
SRF 55V02S
2007-07-02