BGF 112 E6328 Infineon Technologies, BGF 112 E6328 Datasheet
BGF 112 E6328
Specifications of BGF 112 E6328
Related parts for BGF 112 E6328
BGF 112 E6328 Summary of contents
Page 1
...
Page 2
... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
Page 3
BGF112 Revision History: 2008-11-19, V3.0 Previous Version: 2008-10-07, V2.0 Page Subjects (major changes since last revision) All Preliminary status removed Data Sheet AV I/F Device with ESD Protection 3 BGF112 V3.0, 2008-11-19 ...
Page 4
BGF112 Features • ESD protection circuit and filter for AV I/F interface • Integrated ESD protection at external pins contact discharge according to IEC61000-4-2 • Wafer level package with SnAgCu solder balls • RoHS and WEEE compliant ...
Page 5
Table 2 Electrical Characteristics Parameter R R Resistors , 1 2 Capacitors Total ESD junction capacitance of each line to GND Leakage currents ESD diodes to GND Data ...
Page 6
Figure 2 Insertion loss of path A1-A2 or C1- -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 0.1 1 Figure 3 Cross talk of path A1-C2 or ...
Page 7
Package Outlines Solder balls face down STANDOFF Pin 1 2) Corner Index Area 5x COPLANARITY 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum corner identified by marking 3) Primary datum C ...