ML610Q408-NNNTBZ03A7 Rohm Semiconductor, ML610Q408-NNNTBZ03A7 Datasheet - Page 26
ML610Q408-NNNTBZ03A7
Manufacturer Part Number
ML610Q408-NNNTBZ03A7
Description
MCU 8BIT 16K FLASH 8CH 100-TQFP
Manufacturer
Rohm Semiconductor
Series
-r
Datasheets
1.ML610Q482P-NNNTB03A7.pdf
(20 pages)
2.ML610Q407P-NNNTB03A7.pdf
(33 pages)
3.ML610Q407P-NNNTB03A7.pdf
(391 pages)
Specifications of ML610Q408-NNNTBZ03A7
Core Processor
nX-U8/100
Core Size
8-Bit
Speed
2MHz
Connectivity
SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.25 V ~ 3.6 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
100-TFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ML610Q408-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
- ML610Q482P-NNNTB03A7 PDF datasheet
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ML610Q407/ML610Q408/ML610Q409 User's Manual
Chapter 1 Overview
1.3.1.6
Note:
The assignment of the pads P30 to P35 are not in order.
Pin Layout of ML610Q409 Chip
P20
P21
P22
P24
P00
P01
P02
P03
P04
P30
P31
P34
P32
P33
P35
P57
P56
P55
P54
P53
V
V
SS
PP
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
Figure 1-7 Dimensions of ML610Q409 Chip
Chip size: 2.27 mm × 2.23 mm
PAD count: 88 pins
Minimum PAD pitch: 80 μm
PAD aperture: 70 μm×70 μm
Chip thickness: 350 μm
Voltage of the rear side of chip: V
2.27mm
1-10
SS
level.
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
COM4/SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
C2
C1
Y
2.23mm
X
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