ML610Q408-NNNTBZ03A7 Rohm Semiconductor, ML610Q408-NNNTBZ03A7 Datasheet - Page 91
ML610Q408-NNNTBZ03A7
Manufacturer Part Number
ML610Q408-NNNTBZ03A7
Description
MCU 8BIT 16K FLASH 8CH 100-TQFP
Manufacturer
Rohm Semiconductor
Series
-r
Datasheets
1.ML610Q482P-NNNTB03A7.pdf
(20 pages)
2.ML610Q407P-NNNTB03A7.pdf
(33 pages)
3.ML610Q407P-NNNTB03A7.pdf
(391 pages)
Specifications of ML610Q408-NNNTBZ03A7
Core Processor
nX-U8/100
Core Size
8-Bit
Speed
2MHz
Connectivity
SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.25 V ~ 3.6 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
100-TFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ML610Q408-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
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6.3 Description of Operation
6.3.1
6.3.1.1 Low-Speed Clock Generation Circuit
Figure 6-2 shows the circuit configuration of the low-speed clock generation circuit.
For the low-speed clock generation circuit, externally provide a 32.768kHz crystal oscillator and capacitors (C
C
In the STOP mode, the XT0 and XT1 pins become Hiz (high-impedance).
When the ENMLT bit of FCON1 is set to “1”, the low-speed double clock (LSCLK x 2) starts operation.
Note:
DL
Install a crystal as close to the LSI as possible and make sure that signals causing noise and power supply wiring are
not near the crystal and its wiring.
Note that oscillation may stop due to condensation.
).
Low-Speed Clock
V
crystal oscillator
SS
C
GL
32.768kHz
Figure 6-2 Circuit Configuration of 32.768 kHz Crystal Oscillation Mode
C
DL
XT0
XT1
R
V
F
DDL
Control circuit
6-5
ML610Q407/ML610Q408/ML610Q409 User's Manual
2× clock
circuit
Chapter 6 Clock Generation Circuit
STOP mode
Low-speed double clock
(LSCLK x 2)
ENMLT
Low-speed clock
(LSCLK)
GL
and
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