MT49H32M18HT-33:A Micron Technology Inc, MT49H32M18HT-33:A Datasheet - Page 16

• Manufacturer Part Number: MT49H32M18HT-33:A
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M18HT-33:A

• Organization: 32Mx18
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 609mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Figure 7:
PDF: 09005aef80fe62fb/Source: 09005aef809f284b
576Mb_RLDRAM_II_CIO_D2.fm - Rev. H 6/09 EN
Dimensions apply
to solder balls post-
reflow. The pre-
reflow diameter is
Ø0.5 on a Ø0.4 NSMD
ball pad.
144X Ø 0.55
17.00
Seating
plane
0.12 A
Ball A12
144-Ball FBGA
8.50
Notes:
A
1. All dimensions are in millimeters.
4.40
11.00 ±0.10
0.80 TYP
8.80
576Mb: x9, x18, x36 2.5V Vext, 1.8V Vdd, HSTL, CIO, RLDRAM II
C L
5.50 ±0.05
1.00 TYP
Ball A1
C L
9.25 ±0.05
Ball A1 ID
0.75 ±0.05
16
18.50 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
Solder ball material:
62% Sn, 36% Pb, 2% Ag
Substrate material: plastic laminate
Mold compound: epoxy novolac
OR 96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID