ISP1583BS,557 NXP Semiconductors, ISP1583BS,557 Datasheet - Page 4
ISP1583BS,557
Manufacturer Part Number
ISP1583BS,557
Description
Manufacturer
NXP Semiconductors
Datasheet
1.ISP1583BS557.pdf
(100 pages)
Specifications of ISP1583BS,557
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Compliant
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NXP Semiconductors
4. Ordering information
Table 1.
[1]
5. Marking
ISP1583_7
Product data sheet
Type number
ISP1583BS
ISP1583ET
ISP1583ET1
ISP1583ET2
Contains solder ball material SAC105.
Ordering information
[1]
[1]
Package
Name
HVQFN64
TFBGA64
TFBGA64
TFBGA64
Table 2.
[1]
Type number
ISP1583BS
ISP1583ET
ISP1583ET1
ISP1583ET2
The package marking is the first line of text on the IC package and can be used for IC identification.
Description
plastic thermal enhanced very thin quad flat package; no leads; 64 terminals;
body 9
plastic thin fine-pitch ball grid array package; 64 balls; body 6
plastic thin fine-pitch ball grid array package; 64 balls; body 4
plastic thin fine-pitch ball grid array package; 64 balls; body 6
Marking codes
9
0.85 mm
Rev. 07 — 22 September 2008
Marking code
ISP1583BS
ISP1583
1583
1583ET2
Hi-Speed USB peripheral controller
[1]
6
4
6
0.8 mm
0.8 mm
0.8 mm
© NXP B.V. 2008. All rights reserved.
ISP1583
Version
SOT804-1
SOT543-1
SOT969-1
SOT543-1
3 of 99
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