ZT5515A-1BW Intel, ZT5515A-1BW Datasheet - Page 22

• Manufacturer Part Number: ZT5515A-1BW
• Manufacturer: Intel

Specifications of ZT5515A-1BW

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Getting Started
3.2.2
3.2.3
22
Table 2.
Connectivity
The ZT 5515 has no bridge chip and therefore has no CompactPCI* signaling on its J1and J2
connectors. The connectors are only on the board for power and IPMI signaling.
The ZT 5515 features an ejector handle that is keyed for compatible slots. The board can only be
inserted into slots fitted with a compatible mating key.
The ZT 5515 is designed to operate in a backplane providing CompactPCI form factor interfaces at
J1, J2, J3, and J5. The J1 and J2 connectors are supplied for power and IPMI signals. J3 signaling
must comply with the PICMG* 2.16 Packet Switching Backplane specification. The J5 interface
must have through-pins for the ZT 5515 to interface with a rear panel transition card such as the ZT
4807.
See
Electrical and Environmental
The ZT 5515 meets the following requirements:
Electrical and Environmental
The ZT 5515 will not correctly terminate the PCI bus if used in a system master slot since it has no
CompactPCI* bus. If you are planning on using the CompactPCI* bus then you should use a board
that is a CompactPCI* master in the system master slot such as the Intel
System Master Processor Board.
The ZT 5515 is comes with a heatsink that allows the processor to operate between 0° and
approximately 50° C ambient with a minimum of 200 LFM (1 meter per second) of external
airflow. It is the users' responsibility to ensure that the ZT 5515 is installed in a chassis capable of
supplying adequate airflow. The maximum power dissipation of the processor (FCPGA package) is
25 W. External airflow must be provided at all times.
1.2 GHz / 512 Mbyte 4.5 A
Hard disk (add)
(typical)
PMC card typical
(add)
PMC card max.
(add)
† Peak (short duration) power supply current may be significantly higher (up to 50%) and will vary depending
NOTES:
•
•
•
•
1. Consult manufacturer of installed PMC card for actual values.
2. In no case shall the total power dissipated by the PMC card exceed 10.0 W.
Configuration
Intel
upon the application.
Section A.3.2, “Connectors” on page 62
+5V DC +5%, -3% @ 4.5 A typical
+3.3 VDC +5%, -3% @ 2.5 A typical
+12 VDC ±10% @ 20 mA typical
-12 VDC may be required by a PMC peripheral installed on the ZT 5515.
®
NetStructure
2
1
540 mA
1.00 A
1.50 A
(avg)
5 V
TM
ZT 5515 Compute Processor Board Technical Product Specification
TBD†
1.00 A
1.7 0A
3.00 A
(peak)
5 V
2.5 A
N/A
0.75 A
2.25 A
3.3 V
(avg)
for connector descriptions.
TBD†
N/A
1.30 A
4.50 A
(peak)
3.3 V
20 mA
N/A
100 mA
500 mA
(avg)
12 V
50 mA
N/A
200 mA
500 mA
(peak)
12 V
®
NetStructure
0.0 A
N/A
20 mA
500 mA
-12 V
(avg)
TM
0.0 A
N/A
40 mA
500 mA
ZT 5504
(peak)
-12 V