MPCBL5524A1D Intel, MPCBL5524A1D Datasheet - Page 86

• Manufacturer Part Number: MPCBL5524A1D
• Manufacturer: Intel

Specifications of MPCBL5524A1D

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Thermal Considerations
Thermal Considerations
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Caution: To avoid damaging the CPU, do not exceed the maximum processor core temperature
Caution: External airflow must be provided at all times during operation to avoid damaging the CPU. Intel
Intel NetStructure
This appendix describes the thermal requirements to reliably operate a ZT 5524 / MPCBL5524
processor board with a Pentium III processor.
Thermal Requirements
The maximum processor core temperature allowed by the Pentium III processors on the ZT 5524 /
MPCBL5524 is 100° C.
The ZT 5524 / MPCBL5524 comes from the factory with integrated heat sinks to help dissipate the
heat generated by the processors. The maximum ambient air temperature required by the heat sinks
to maintain core temperature below the maximum is 45° C. The maximum ambient air temperature
assumes an airflow of 250 linear feet per minute past the heat sinks.
strongly recommends use of a fan tray below the card rack to supply the external airflow.
Temperature Monitoring
Because reliable long-term operation of the ZT 5524 / MPCBL5524 depends on maintaining
proper temperature, Intel strongly recommends that you verify the operating temperature of the
processor (core) in your final system configuration.
The Pentium III processor incorporates an on-die thermal diode that can be used to monitor the
processor’s die temperature. The ZT 5524 / MPCBL5524 includes an ADM1026 device that is
monitored through the BMC. This device checks the die temperature of the processor for thermal
management purposes.
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ZT 5524 / MPCBL5524 High-Performance System Master Processor Board TPS
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