MPC8555ECPXAJD Freescale Semiconductor, MPC8555ECPXAJD Datasheet - Page 71

• Manufacturer Part Number: MPC8555ECPXAJD
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8555ECPXAJD

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• For Use With: MPC8555CDS - BOARD EVALUATION CDS FOR 8555CWH-PPC-8555N-VX - BOARD EVAL QUICCSTART MPC8555CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540CWH-PPC-8555N-VE - EVALUATION SYSTEM QUICC MPC8555E
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,
and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that allows the
MPC8555E to function in various environments.
16.2.1
For system thermal modeling, the MPC8555E thermal model is shown in
to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block
29x29x1.6 mm with the conductivity adjusted accordingly. The die is modeled as 8.7 x 9.3 mm at a
thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed resistance between the die and
substrate assuming a conductivity of 4.4 W/m•K in the thickness dimension of 0.07 mm. The lid attach
adhesive is also modeled as a collapsed resistance with dimensions of 8.7 x 9.3 x 0.05 mm and the
conductivity of 1.07 W/m•K. The nickel plated copper lid is modeled as 11 x 11 x 1 mm.
Freescale Semiconductor
Bump/Underfill—Collapsed resistance
Lid Adhesive—Collapsed resistance
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Conductivity
Substrate and Solder Balls
Recommended Thermal Model
k
k
k
k
k
k
k
k
x
y
z
(8.7 × 9.3 × 0.05 mm)
z
(8.7 × 9.3 × 0.75 mm)
(8.7 × 9.3 × 0.07 mm)
z
x
y
z
(25 × 25 × 1.6 mm)
(11 × 11 × 1 mm)
Lid
Die
Value
1.07
14.2
14.2
360
360
360
4.4
1.2
Figure 44. MPC8555E Thermal Model
W/(m × K)
Unit
y
z
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
Substrate and solder balls
Heat Source
Substrate
Figure
Die
Lid
44. Five cuboids are used
Bump/underfill
Adhesive
Thermal
71